A Preliminary Study of the Use of Kynar® Piezoelectric Film to Measure Peel Stresses in Adhesive Joints

Abstract A variety of test techniques have been developed to test the performance of adhesives bonded in situ within joints. Most of these techniques measure strength, fracture toughness, or adhesive modulus of the bonded joint. Techniques to measure actual stress or strain values within a bonded joint are quite few in number. The Krieger gage1 is able to measure the average shear displacement along a 12.5 mm. gage length of a thick adherend joint. It has been used primarily to measure in situ shear moduli of adhesives. Brinson and his colleagues2 proposed bonding strain gages within adhesive joints to measure strains within the adhesive. Unfortunately, these gages are only sensitive to the lateral strains and not shear or peel strains. Because the lateral strains are dominated by the behavior of the adherends rather than the adhesive, the information which can be gained is incomplete.