Factors Affecting the Processing of Epoxy Film Adhesives: I. Room Temperature Aging
Source abstract
Abstract
Abstract Differential scanning calorimetry, dielectric analysis, and infrared spectroscopy were used to study the changes which occur at room temperature in an epoxy film adhesive cured, in part, with dicyandiamide. The principal reaction involved interaction of the catalyst with the lower molecular weight resins in the formulation. The overall effect was demonstrated by an increase in resin viscosity, softening point and overall cure time, accompanied by a decrease in resin flow and ultimate bonded joint strength.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Epoxy Resin Curing Processes · Synthesis and properties of polymers · Photopolymerization techniques and applications
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (12)
Show source-provided references
1. Carpenter J. F. · SAMPE J. · 1979 · 24 · 446
2. Martin B. G. · Materials Evaluation · 1976 · 34 · 49
3. Sanjana, Z. N., Saunders, H. E. and Khattak, R. K. Proc. 14th Electrical/Electronics Insulation Cont. pp.119Boston, MA IEEE Publn. No. 79CH 1510–7-E1
4. Sanjana, Z. N. and Selby, R. L. Proc. 14th Electrical/Electronics Insulation Cont. pp.163Boston, MA IEEE Publn. No. 79CH 1510–7-E1
5. Levine H. H. · ACS Div. (Meet.) Org. Coat. Plast. Chem. Preprints · 1964 · 24 · 293
6. Eyerer P. · J. Appl. Poly. Sci. · 1971 · 15 · 306710.1002/app.1971.070151215 ↗
7. Rao · 1963
8. Sather E. · Polymer · 1973 · 14 · 9110.1016/0032-3861(73)90055-4 ↗
9. Saunders T. F. · J. Poly. Sci. A-1 · 1967 · 5 · 160910.1002/pol.1967.150050711 ↗
10. Gillham J. K. · Polymer Eng. and Sci. · 1979 · 19 · 67610.1002/pen.760191005 ↗
11. Schneider N. S. · Polymer Eng. and Sci. · 1979 · 19 · 30410.1002/pen.760190413 ↗
12. Doyle M. J. · Polymer Eng. and Sci. · 1979 · 19 · 68710.1002/pen.760191007 ↗