Plasmonic properties of silicon nitride encapsulated copper

We investigated the optical properties (i.e. plasmonic loss) of thin-film copper that was deposited and processed in a 300mm CMOS pilot line. The optical properties at 1550 nm (Q _SPP,Cu = 3921 ± 350) were evaluated by measuring the propagation loss of dielectric loaded plasmonic waveguides on samples with high and low root mean square surface roughness (R _q ) with and without a silicon nitride diffusion barrier and at room temperature and cryogenic temperatures. In our fabrication result, the average grain size is 2.08±0.05 μ m, which is much larger than the mean free path of free electrons in copper, so the surface roughness becomes the main cause of the waveguide propagation loss from the fabrication constrains. Further, we show that copper can be encapsulated by a 15 nm silicon nitride diffusion and oxidation barrier without degrading the optical properties.