journal article·2026-03-04

Fast and quantitative noncontact laser ultrasound tapping detection of debonding in aerospace honeycomb sandwich panel based on autoencoder-softmax

Qiang Wu, Weichen Xie, Yi Xiong, Shiyuan Zhou, Menglong Liu, Zhongqing Su

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Abstract

Aerospace grade honeycomb sandwich panels (HSPs) feature ultra-thin skins and honeycomb walls and thus are prone to debonding defects during manufacturing and service. A fast, non-destructive, and noncontact laser ultrasound tapping method combining the local fine C-scan imaging and the global sparse C-scan is proposed to detect the debonding in the ultrathin aerospace HSP. Firstly, by measuring the thermoelastic laser-induced vibration signals with fine C-scan at a small-scale region including both known intact and debonding defects, an automatic labelling algorithm is proposed to construct the dataset for training the Autoencoder (AE)-Softmax model. Then, based on the trained AE-Softmax model, the sparse C-scan only at the centroid of each honeycomb cell can quickly identify suspicious defects with low credibility in the HSP. Further, the suspicious cells in HSP are fine scanned to differentiate the intact or debonding status according to the area proportion of the connected component in the C-scan image. Finally, experiments are carried out in a second HSP to validate the proposed method, that all the four diversified defects, including multiple-debonding cells, one debonding wall, and adhesive removals, are successfully detected without false alarm, and the detection efficiency has been improved over 100 times compared with the conventional dense C-scan imaging.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Industrial Vision Systems and Defect Detection · Medical Image Segmentation Techniques · Image and Object Detection Techniques

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

China Academy of Space Technology

Harbin Institute of Technology

Southern University of Science and Technology

Beijing Institute of Technology

The Hong Kong Polytechnic University

Funding

National Science and Technology · Basic and Applied Basic Research Foundation of Guangdong Province · National Natural Science Foundation of China · Innovation and Technology Commission Hong Kong SAR · Research Grants Council of Hong Kong SAR · Shenzhen Stable Support Grant · Science and Technology Innovation Commission of Shenzhen · Key Laboratory of Design and Manufacturing Technologies for Composite Structures

References (41)

Show source-provided references
1. 10.1016/j.engstruct.2023.11731810.1016/j.engstruct.2023.117318 ↗
2. 10.1007/s11431-020-1650-910.1007/s11431-020-1650-9 ↗
3. 10.1016/j.ultras.2023.10714410.1016/j.ultras.2023.107144 ↗
4. 10.1016/j.applthermaleng.2014.03.06010.1016/j.applthermaleng.2014.03.060 ↗
5. 10.5267/j.esm.2019.9.00210.5267/j.esm.2019.9.002 ↗
6. 10.1109/AERO.2010.544674810.1109/AERO.2010.5446748 ↗
7. 10.1177/1099636222111688710.1177/10996362221116887 ↗
8. Zenkert D. The handbook of sandwich construction, Dan Zenkert, Ed. Stock. Sweden: Nord. Ind. Fund (NI), Oslo, Norway, Swedish Natl. Board Ind. Tech. Dev. (NUTEK); 1997. p. 442.
9. 10.1016/j.ndteint.2021.10246910.1016/j.ndteint.2021.102469 ↗
10. 10.1016/j.ndteint.2016.06.00210.1016/j.ndteint.2016.06.002 ↗
11. 10.1088/1361-665X/ac01a810.1088/1361-665X/ac01a8 ↗
12. 10.1007/s10921-023-01006-z10.1007/s10921-023-01006-z ↗
13. 10.1016/j.optlastec.2023.11039210.1016/j.optlastec.2023.110392 ↗
14. 10.1016/j.ndteint.2021.10242110.1016/j.ndteint.2021.102421 ↗
15. 10.1016/j.ndteint.2023.10292710.1016/j.ndteint.2023.102927 ↗
16. 10.1080/10589759.2014.94184010.1080/10589759.2014.941840 ↗
17. 10.1007/s42405-019-00210-410.1007/s42405-019-00210-4 ↗
18. 10.3390/app902028310.3390/app9020283 ↗
19. 10.1121/1.38712610.1121/1.387126 ↗
20. 10.1016/j.apacoust.2021.10795610.1016/j.apacoust.2021.107956 ↗
21. 10.1016/j.acme.2018.08.00410.1016/j.acme.2018.08.004 ↗
22. 10.1088/0957-0233/24/8/08520110.1088/0957-0233/24/8/085201 ↗
23. 10.1784/insi.2010.52.3.13010.1784/insi.2010.52.3.130 ↗
24. 10.1016/j.measurement.2024.11616010.1016/j.measurement.2024.116160 ↗
25. 10.1007/s10921-022-00910-010.1007/s10921-022-00910-0 ↗
26. 10.1080/10589759.2024.240288510.1080/10589759.2024.2402885 ↗
27. 10.1080/10589759.2024.239099610.1080/10589759.2024.2390996 ↗
28. 10.1007/s00542-020-04783-z10.1007/s00542-020-04783-z ↗
29. 10.1080/01431161.2020.180765010.1080/01431161.2020.1807650 ↗
30. 10.3390/electronics902027410.3390/electronics9020274 ↗
31. 10.1109/72.65503810.1109/72.655038 ↗
32. 10.1016/j.jprocont.2018.02.00410.1016/j.jprocont.2018.02.004 ↗
33. 10.1016/j.ymssp.2022.10986110.1016/j.ymssp.2022.109861 ↗
34. 10.1016/j.ndteint.2020.10221810.1016/j.ndteint.2020.102218 ↗
35. 10.1109/TII.2020.297675210.1109/TII.2020.2976752 ↗
36. 10.1109/TIM.2021.307213110.1109/TIM.2021.3072131 ↗
37. 10.1109/JAS.2019.191139310.1109/JAS.2019.1911393 ↗
38. 10.1007/s10044-008-0109-y10.1007/s10044-008-0109-y ↗
39. 10.1109/TCYB.2021.310961810.1109/TCYB.2021.3109618 ↗
40. 10.1109/TCST.2019.289794610.1109/TCST.2019.2897946 ↗
41. 10.1109/ChiCC.2015.726063410.1109/ChiCC.2015.7260634 ↗