RF sputtered hexagonal boron nitride film-based printed circuit board for high voltage and high-power electronic applications
Source abstract
Abstract
The power electronic devices use big heat sinks for the removal of heat from the components. These heat sinks are bulk in size. Therefore, the strategy is to remove the heat sink from the PCB and i...
Only a short abstract or summary was supplied by the source.
Source: openalex_inverted_index · Quality: short
Research context
OpenAlex topics: Thermal properties of materials · Heat Transfer and Optimization
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References
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