Failure site transition in Pb-free solder joints caused by manufacturing variabilities in BGA and MLF components in low cycle fatigue analysis
Source abstract
Abstract
A comprehensive three level design of experiment that is applied on the manufacturing process to compare the effect of variability in printing and reflow processes on quality and durability of Micro Lead Frame (MLF) and Ball Grid Array (BGA) components. The quality and durability of the BGA and MLF components were studied very closely by thermo-mechanical experiment and finite element simulation. Different populations of failures indicating different failure site and mechanisms were observed in both BGA and MLF components. Conflictions were observed when parameter variations caused durability improvement in one type and durability degradation in the other package.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Integrated Circuits and Semiconductor Failure Analysis
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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