Phase diagram investigation and characterisation of ternary Sn In Me (Me = Ag, Cu) lead-free solder systems

The Sn?In?Me (Me = Ag, Cu) systems belong to the group of potential candidates for lead-free solder materials. Samples, representing two vertical sections: with In : Ag = 7 : 3 from Sn?In?Ag ternary system and with Cu : In = 1 : 9 from Sn?In?Cu ternary system, were measured with Differential Scanning Calorimetry (DSC). The experimental transformation temperatures were compared with CALPHAD-type calculation results based on thermodynamic parameter values from COST531 database. The characterisation of investigated samples was done using Scanning Electron Microscopy with Energy Dispersive X-ray (SEM?EDX), Light Optical Microscopy (LOM), electroconductivity and microhardness measurements.