Computer-aided design for microelectromechanical systems (MEMS)

With the advancements of MEMS foundry services and CAD tools, MEMS devices can be cost-effectively designed and prototyped. Here, four designs that utilise these tools are presented:(1) a flexure design used to reduce the device warpage resulting from the mismatch in thermal expansion coefficients between the device and the substrate for flip-chip bonded MEMS, (2) a digitally positioned micromirror using multiple contacts, (3) a large MEMS flap that achieves uniform movement for fluid mixing, and (4) a 3-dimensional, solder-assembled MEMS device that has been optimised for minimal deviation from the desired assembly angle.