Research on parametric analysis for stress of Plastic Ball Grid Array solder joint under shock load
Source abstract
Abstract
The dynamic response of a Plastic Ball Grid Array (PBGA) assembly under high acceleration load was investigated. Several influencing factors on solder joint stress were studied by using ANSYS. The results indicate that the location of the solder joint is the most important factor and that the outmost solder balls of the PBGA experience maximum stresses. The solder joint height, the modulus of Ball Grid Array (BGA) have little effect on the stress. The peak stress can be reduced effectively by increasing the diameter of the solder joints, reducing the modulus of the solder joint materials.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Mechanical Engineering and Vibrations Research · High-Velocity Impact and Material Behavior
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