Yield zones in polycarbonate DCB testpieces
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Abstract
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Research context
OpenAlex topics: Material Properties and Processing · Electronic Packaging and Soldering Technologies · High voltage insulation and dielectric phenomena
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References (4)
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1. Y. W. Mai, International Journal of Fracture 9 (1973) 349?351.10.1007/BF00049220 ↗
2. M. F. Kanninen, International Journal of Fracture 9 (1973) 83?92.10.1007/BF00035958 ↗
3. C. Gurney, Y. W. Mai and R. C. Owe, Proceedings of the Royal Society, (London) (to appear).
4. G. T. Hahn, M. Sarrate and A. R. Rosenfield, International Journal of Fracture Mechanics 7 (1971) 435?446.10.1007/BF00189113 ↗