On debonding of thin films

Debonding of a thin film from a large substrate is analyzed by an interface crack model. Based on a solution to interface cracks given by the author, energy release rate and stress intensity factors at the interface crack between the film and the substrate under general film edge loads are determined analytically. The solution is favorably compared with the result from the literature. Thermal stress intensities due to a uniform temperature change are also considered. The solution may be helpful for the analysis and testing of thin film debondings.