Flow and fracture of free-standing Ag and Cu thin films and Ag/Cu multilayers
Source abstract
Abstract
Free-standing polycrystalline films of Ag, Cu and Ag/Cu multilayers were tested in tension using an optical diffraction grating for the measurement of the strain. The yield stress and the rate of work hardening both increase strongly with decreasing layer thickness. These effects combine to raise the stress for ductile fracture up to 700 MPa and to lower the maximum plastic strain.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Copper Interconnects and Reliability · Metal and Thin Film Mechanics · Advanced Surface Polishing Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (12)
Show source-provided references
1. Chokshi, A.H., Rosen, A., Karch, J. and Gleiter, H. (1989). Scripta Metall. 23, 1679.10.1016/0036-9748(89)90342-6 ↗
2. Embury, J.D. and Hirth, J.P. (1994). Acta metall. Mater. 42, 2051.10.1016/0956-7151(94)90030-2 ↗
3. Huang, H. and Spaepen, F. (2000). Acta Mater. 48, 3216.
4. Kocks, U.F. (1985). Dislocations and Properties of Real Materials, Proc. 50th Anniversary of the Concept of Dislocations in Crystals, The Institute of Metals, London, 144.
5. Kretschmar, A., Kuschke, W.M., Baker, S.P. and Arzt, E. (1997). Mater. Res. Soc. Symp. 436, 59.10.1557/PROC-436-59 ↗
6. Misra, A., Verdier, M., Lu, Y., Kung, H., Mitchell, T.E., Nastasi, M.and Embury, J.D. (1998). Scripta Metall. 39, 555.10.1016/S1359-6462(98)00196-1 ↗
7. Read, D.T. (1998). Meas. Sci. Technol. 9, 676.10.1088/0957-0233/9/4/016 ↗
8. Ruud, J.A., Josell, D., Spaepen, F. and Greer, A.L. (1993). J. Mat. Res. 8, 112.10.1557/JMR.1993.0112 ↗
9. Sharpe, W.N. (1982). Opt. Engineering 21, 483.10.1117/12.7972934 ↗
10. Sun, X.S., Reglero, R., Sun, X.K. and Yacaman, M.J. (2000). Mat. Chem. and Phys. 63, 82.10.1016/S0254-0584(99)00214-X ↗
11. Thompson, C.V. and Carel, R. (1996). J. Mech. Phys. Solids 44, 657.10.1016/0022-5096(96)00022-1 ↗
12. Verdier, M., Huang, H., Spaepen, F., Embury, J.D., Hawley, M. and Kung, H. unpublished.