Fiducial mark and CTOA estimates of thin film adhesion
Source abstract
Abstract
Carbon fiducial marks are formed during thin film local delamination processes induced either by su- perlayer indentation forming circular blisters, or by residual stress relief through telephone cord blister formations. Hydrocarbons are sucked into the crack tip during the delamination process, outlining the crack tip opening angle (CTOA), which can be used to back calculate thin film adhesion using either elastic or plastic analyses presented here. Fiducial marks have been observed in two different thin films systems, namely Cu/SiO2 and TiWXNY/GaAs. TiWXNY/GaAs system also exhibited biaxial compressive stress-induced phone cord buckling delaminations. Surface AFM CTOA measurement approach is used to estimate the strain energy release rate increase along these phone cords delaminations.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Metal and Thin Film Mechanics · Advanced Surface Polishing Techniques · Advanced ceramic materials synthesis
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (27)
Show source-provided references
1. Bagchi, A. and Evans, A. (1995). Thin film decohesion and its measurement. Materials Research Society Symposium Proceedings, vol. 383, Materials Research Society, Pittsburgh, Pennsylvania, 183.
2. Bagchi, A., Lucas, G., Suo, Z. and Evans, A. (1994). A new procedure for measuring the decohesion energy for thin ductile films on substrates. J. Mater. Res. 9(7), 1734.10.1557/JMR.1994.1734 ↗
3. Dauskardt, R.H., Lane, M., Ma, Q. and Krishna, N. (1998). Adhesion and debonding of multi-layer thin film structures. Engineering Fracture Mech. 61, 141.10.1016/S0013-7944(98)00052-6 ↗
4. Gerberich, W.W., Kramer, D.E., Tymiak, N.I., Volinsky, A.A., Bahr, D.F. and Kriese, M. (1999). Nanoindentationinduced defect-interface interactions: phenomena, methods and limitations. Acta Mater. 47(15), 4115.10.1016/S1359-6454(99)00270-0 ↗
5. Kriese, M.D., Gerberich, W.W. and Moody, N.R. (1999). Quantitative adhesion measures of multilayer films. Part I. Indentation mechanics. Part II. Indentation of W/Cu, W/W, Cr/W. J. Mater. Res. 14(7), 3007 (Part I), 3019 (Part II)10.1557/JMR.1999.0404 ↗
6. Lawn, B. (1993). Fracture of Brittle Solids, Cambridge University Press, Cambridge.10.1017/CBO9780511623127 ↗
7. Marshall, D.B. and Evans, A.G. (1984).Measurement of adherence of residually stressed thin films by indentation. I. Mechanics of interface delamination. J. Appl. Phys. 56, 2632.10.1063/1.333794 ↗
8. Moody, N.R., Medlin, D., Norwood, D.P. and Gerberich, W.W. (1997). Aging effects on the durability of tantalum nitride films. Materials Research Society Symposium Proceedings, Vol. 505, Materials Research Society, Pittsburgh, Pennsylvania, 97.
9. Moody, N.R., Hwang, R.Q., Venka-Taramani, S., Angelo, J.E., Norwood, D.P. and Gerberich, W.W. (1998a). Adhesion and fracture of tantalum nitride films. Acta Materialia 46(2), 585.10.1016/S1359-6454(97)00243-7 ↗
10. Moody, N.R., Medlin, D., Boehme, D. and Norwood, D.P. (1998b). Film thickness effects on the fracture of tantalum nitride on aluminum nitride thin film systems. Engineering Fracture Mechanics 61(1), 107.10.1016/S0013-7944(98)00055-1 ↗
11. Moody, N.R., Adams, D., Volinsky, A.A., Kriese, M. and Gerberich, W.W. (2000). Annealing effects on interfacial fracture of gold-chromium films in hybrid microcircuits. Materials Research Society Symposium Proceedings, Vol. 586, Materials Research Society, Pittsburgh, Pennsylvanie, 195.
12. Moody, N.R. et al. (2001). unpublished work.
13. Sanchez, J.M., El-Mansy, S., Sun, B., Scherban, T., Fang, N., Pantuso, D., Ford, W., Elizalde, M.R., Martinez-Escanola, J.M., Martin-Meizoso, A., Gil-Sevillano, J., Fuentes, M. and Maiz, J. (1999). Cross-sectional nanoindentation: A new technique for thin film interfacial adhesion characterization.Acta Mater. 4(17), 4405.10.1016/S1359-6454(99)00254-2 ↗
14. Schneider, J.A., Guthrie, S.E., Kriese, M.D., Clift, W.M. and Moody, N.R. (1998). Effect of carbon on the adhesion of aluminum films to sapphire substrates. Materials Research Society Symposium Proceedings, Vol. 522, Materials Research Society, Pittsburgh, Pennsylvania, 347.
15. Schneider, J.A., Guthrie, S.E., Kriese, M.D., Clift, W.M. and Moody, N.R. (1999). Impurity effects on the adhesion of aluminum films on sapphire substrates. Materials Science & Engineering A (Structural Materials: Properties, Microstructure and Processing) A259(2), 253.10.1016/S0921-5093(98)00897-1 ↗
16. Tymiak, N.I., Volinsky, A.A., Kriese, M.D., Downs, S.A. and Gerberich, W.W. (2000). The role of plasticity in bi-material fracture with ductile interlayers. Metallurgical and Materials Transactions A 31A, 863.10.1007/s11661-000-1006-1 ↗
17. Vlassak, J.J. and Nix, W.D. (1992). New bulge test technique for the determination of Young'smodulus and Poisson'sratio of thin films. J. Mater. Res. 7, 3242.10.1557/JMR.1992.3242 ↗
18. Vlassak, J.J., Drory, M.D. and Nix, W.D. (1997). Simple technique for measuring the adhesion of brittle films to ductile substrates with application to diamond-coated titanium. J. Mater. Res. 12(7), 1900.10.1557/JMR.1997.0260 ↗
19. Volinsky, A.A. (2000). The Role of Geometry and Plasticity in Thin, Ductile Film Adhesion, Ph.D. Dissertation, University of Minnesota, Minneapolis.
20. Volinsky, A.A. and Gerberich, W.W. (1999b). Acoustic emission analysis of fracture events in Cu films with W overlayer. Materials Research Society Symposium Proceedings, Vol. 563, Materials Research Society, Pittsburgh, Pennsylvania, 75.
21. Volinsky, A.A., Clift, W.M., Moody, N.R. and Gerberich, W.W. (1999a). Indentation-induced ductile film interfacial debonding. Materials Research Society Symposium Proceedings, Vol. 586, Materials Research Society, Pittsburgh, Pennsylvania, 255.
22. Volinsky, A.A., Tymiak, N.I., Kriese, M.D., Gerberich, W.W. and Hutchinson, J.W. (1999a). Quantitative modeling and measurement of copper thin film adhesion. Materials Research Society Symposium Proceedings, Vol. 539, Materials Research Society, Pittsburgh, Pennsylvania, 277.
23. Volinsky, A.A., Moody, N.R. and Gerberich, W.W. (2000). Superlayer residual stress effect on the indentation adhesion measurements. Materials Research Society Symposium Proceedings, Vol. 594, Materials Research Society, Pittsburgh, Pennsylvania, 383.
24. Volinsky, A.A., Vella, J.B., Fowler, B.W., Adhihetty, I.S. and Gerberich, W.W. (2001). Mechanical properties, adhesion, and fracture toughness of low-K dielectric thin films for microelectronic applications, presented at 2001 Mechanics and Materials Summer Conference, San Diego, June 2001.
25. Volinsky, A.A, Moody, N.R. and Gerberich, W.W. (2002a). Interfacial toughness measurements for thin films on substrates. Acta Mater. 50(3), 441–466.10.1016/S1359-6454(01)00354-8 ↗
26. Volinsky, A.A., Kottke, M.L., Moody, N.R., Adhihetty, I.S. and Gerberich, W.W. (2002b). Fiducial marks as a measure of thin film crack arrest toughness. 10th International Conference on Fracture, Honolulu, HI, 2001.10.1016/S0013-7944(02)00003-6 ↗
27. Volinsky, A.A., Kottke, M.L., Moody, N.R. and Gerberich, W.W. (2002c). Fiducial mark and nanocrack zone formation during thin film delamination. Philosophical Magazine A82(17/18),3383–3391.