Debonding of a Weak Interface in Front of a Through-Thickness Crack
Source abstract
Abstract
A through thickness crack traversing a laminate and approaching an interface weakened by the presence of a small debonding defect is analysed in the case when the defect is fully embedded in the K-field of the main crack. Plane approximation estimates of critical interfacial strength for crack deflection are compared with 3D calculations using integral equation and weight function formulations.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Numerical methods in engineering · Composite Material Mechanics · Contact Mechanics and Variational Inequalities
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References (7)
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