Comparative study on stress–strain hysteresis response of SAC solder joints under thermal cycles
Source abstract
Abstract
The present study attempts to evaluate the stress-strain hysteresis responses of SAC solder joints in Resistor and FleXBGA144 packages subjected to thermal cyclic loading using several constitutive models. The total deformation of the solder material consists of elastic, rate-independent plastic and rate-dependent creep components. The constitutive models discussed in this study each weighted elastic, plastic and creep deformations differently. At low stresses SAC solder alloys were found to be creep resistant, where at higher stresses, the influence of different microstructures disappears as matrix-creep dominates in this region. Thus, the proper constitutive model requires all the three ingredients of the elastic, the creep, and the time-independent plastic data for different stress levels to effectively predict the hysteresis behavior of the SAC solder alloys. The hysteresis loops predicted by constitutive models were also found in close agreement with the loops generated by FEM for the SAC solder joint subjected to thermal cycling.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · High Temperature Alloys and Creep · Intermetallics and Advanced Alloy Properties
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (15)
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