Vapor Pressure and Residual Stress Effects on Mixed Mode Toughness of an Adhesive Film

Temperature- and moisture- induced delamination leading to popcorn package cracking is a major package reliability issue for surface-mount plastic encapsulated microcircuits (PEM). Crack propagation along one of the interfaces of a ductile adhesive joining two elastic substrates is modeled to study interface delamination and toughness of PEMs. The polymeric adhesive is stressed by remote loading and residual stress. Along the crack front, the film-substrate interface is modeled by a strip of cells that incorporates vapor pressure effects on void growth and coalescence through a Gurson porous material relation. Results show that under high levels of vapor pressure, increasing film thickness will produce smaller enhancement on the steady-state fracture resistance of the interface, also referred to as the joint toughness. Across all mode mixity levels, vapor pressure effects dominate over residual stress. The adverse effects of vapor pressure are greatest in highly porous adhesives subjected to a strong mode II component. The latter is representative of the likely state of loading in IC packages since residual stress, resulting from the film-substrate thermal mismatch, induces a predominantly mode II component.