Temperature dependence of cohesive laws for an epoxy adhesive in Mode I and Mode II loading
Source abstract
Abstract
The influence of the temperature on the cohesive laws for an epoxy adhesive is studied in the glassy region, i.e. below the glass transition temperature. Cohesive laws are derived in both Mode I and Mode II under quasi-static loading conditions in the temperature range $$-30\le T \le 80\,\circ $$ C. Three parameters of the cohesive laws are studied in detail: the elastic stiffness, the peak stress and the fracture energy. Methods for determining the elastic stiffness in Mode I and Mode II are derived and evaluated. Simplified bi-linear cohesive laws to be used at any temperature within the studied temperature range are derived for each loading mode. All parameters of the cohesive laws are measured experimentally using only two types of specimens. The adhesive has a nominal layer thickness of 0.3 mm and the crack tip opening displacement is measured over the adhesive thickness. The derived cohesive laws thus represent the entire adhesive layer as having the present layer thickness. It is shown that all parameters, except the Mode I fracture energy, decrease with an increasing temperature in both loading modes. The Mode I fracture energy is shown to be independent of the temperature within the evaluated temperature span. At $$80\,\circ $$ C the Mode II fracture energy is decreased to about 2/3 of the fracture energy at $$-30\,\circ $$ C. The experimental results are verified by finite element analyses.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Mechanical Behavior of Composites · Structural Analysis of Composite Materials · Epoxy Resin Curing Processes
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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