Water-assisted sub-critical crack growth along an interface between polyimide passivation and epoxy underfill
Source abstract
Abstract
Direct chip attach (DCA) microelectronic packaging technology is gaining prominence due to its numerous advantages. Delamination (debonding) of the underfill epoxy/ polyimide passivation interface of a DCA during hydro-thermal reliability testing has always been one of the salient problems. We have studied the water-assisted sub-critical crack growth along this interface and our measurement offers important clues as to the origins of the poor hydro-thermal testing results for these interfaces. A modified asymmetric double cantilever beam (ADCB) testing technique has been used to measure the sub-critical crack growth velocity v at various relative humidities and temperatures as a function of the crack driving force (strain energy release rate) G*. The presence of a significant partial pressure of water pH2O produces a marked decrease (by up to a factor of 12) in the threshold G* for crack growth at measurable velocities. Above the threshold log v rises linearly with \(\sqrt {G^ * } \) but then enters a regime where the crack velocity (v=v*) is almost independent of \(\sqrt {G^ * } \). Finally, at the values of G* corresponding to rapid crack propagation in the absence of water, log v increases very rapidly with G*. By analogy to the classic work on water-assisted sub-critical crack growth in silica-based glasses, where very similar features are observed, we believe that the sub-critical crack growth along the polyimide-epoxy interface results from stress-assisted hydrolysis of primary covalent bonds, in our case ester bonds across the interface. The regime of \(\sqrt {G^ * } \) just above the threshold corresponds to a physicochemical situation where the water activity (pH2O) at the crack tip is the same as that of the gaseous environment. In the regime where v=v*≈ constant, the water activity at the crack tip is below that in the environment and the crack growth velocity is limited by the transport of water vapor to the bonds ahead of the crack tip. We develop a model of this crack growth following Wiederhorn 1967 that allows us to predict the sub-critical crack growth as a function of G* for arbitrary relative humidity and temperature conditions.
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OpenAlex topics: Electronic Packaging and Soldering Technologies · Advanced MEMS and NEMS Technologies · Mechanical Behavior of Composites
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References (100+)
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1. Bascom, W.D. (1974). The surface chemistry of moisture-induced composite failure. Interfaces in Polymer Matrix Composites 6 (Edited by Plueddemann, E.P.) Academic Press, New York, 79–109.
2. Bird, R.B., Stewart, W.E. and Lightfoot, E.N. (1960). Transport Phenomena, JohnWiley and Sons Inc., New York.
3. Brown, S.D. (1978). The Charles-Hillig subcritical crack velocity reconsidered. Journal of The American Ceramic Society 61, 367–368.10.1111/j.1151-2916.1978.tb09330.x ↗
4. Brown, S.D. (1979). Multibarrier kinetics of brittle fracture: I, Stress dependence of the subcritical crack velocity. Journal of The American Ceramic Society 62, 515–524.10.1111/j.1151-2916.1979.tb19118.x ↗
5. Buchwalter, S.L. and Kosbar, L.L. (1996). Cleavable epoxy resins: Design for disassembly of a thermoset. Journal of Polymer Science: Part A: Polymer Chemistry 34, 249–260.10.1002/(SICI)1099-0518(19960130)34:2<249::AID-POLA11>3.0.CO;2-Q ↗
6. Buchwalter, S.L. (1996). Formulating a cycloaliphatic epoxy or microelectronic encapsulation: A DSC study on a model system. Presentation at the American Chemical Society 211: 220-POLY, Part 2 MAR 24 1996.
7. Calistri-Yeh, M., Kramer, E.J., Sharma, R., Zhao, W., Rafailovich, M.H., Sokolov, J. and Brock, J.D. (1996). Thermal Stability of Self-Assembled Monolayers from Alkylchlorosilances. Langmuir 12, 2747–2755.10.1021/la950518u ↗
8. Carter, W. (1997). Fax Transmission from Union Carbide Corporation, Bound Brook.
9. Charles, R.J. and Hillig, W.B. (1961). The kinetics of glass failure by stress corrosion, Symposium on the Mechanical Strength of Glass and Ways of Improving it. Union Scientifique Continentale du Verre, France, 511–527.
10. Conley, K.M., Ritter, J.E. and Lardner, T.J. (1992). Subcritical crack growth along epoxy/glass interfaces. Journal of Materials Research 7, 2621–2629.10.1557/JMR.1992.2621 ↗
11. Coulson, J.M. and Richardson, J.F. (1955). Chemical Engineering. McGraw-Hill Book Co., New York.
12. Crank, J. (1975). The Mathematics of Diffusion. Oxford University Press, UK.
13. CRC (1987). CRC Handbook of Chemistry and Physics. CRC Press, Boca Raton, FL, USA.
14. Dauskardt, R.H., Lane, M., Ma, Q. and Krishna, N. (1998). Adhesion and debonding of multi-layer thin film structures. Engineering Fracture Mechanics 61, 141–162.10.1016/S0013-7944(98)00052-6 ↗
15. Davies, T., Goldsmith, P.L., Ravens, D.A.S. and Ward, I.M. (1962). The kinetics of the hydrolysis of polyethylene terephthalate film. Journal of Physical Chemistry 66, 175–176.10.1021/j100807a503 ↗
16. Doremus, R.H. (1980). Modification of the Hillig-Charles theory for static fatigue of glass. Engineering Fracture Mechanics 13, 945–953.10.1016/0013-7944(80)90024-7 ↗
17. Dylis, D.D. and Ebel, G.H. (1994). Long term package integrity in a military environment. Proceedings of the 20th International Symposium for Testing and Failure Analysis, 163–168.
18. Evans, A.G. (1975). The fracture stress and its dependence on slow crack growth. Journal of Materials Science 10, 214–222.10.1007/BF00540345 ↗
19. Evans, A.G. and Johnson, H. (1975). The fracture stress and its dependence on slow crack growth. Journal of Materials Science 10, 214–222.10.1007/BF00540345 ↗
20. Evans, A.G. (1974). Slow crack growth in brittle materials under dynamic loading conditions. Internal Journal of Fracture 10, 251–259.10.1007/BF00113930 ↗
21. Evans, A.G.; Linzer, M. (1973). Failure prediction in structural ceramics using acoustic emission. Journal of the American Ceramic Society 56, 575–581.10.1111/j.1151-2916.1973.tb12419.x ↗
22. Evans, A.G. (1972). A method for evaluating the time-dependent failure characteristics of brittle materials-and its application to polycrystalline alumina. Journal of Materials Science 7, 1137–1146.10.1007/BF00550196 ↗
23. Eyring, H., Lin, S.H. and Lin, S.M. (1980). Basic Chemical Kinetics. John Wiley and Sons, New York.
24. Fox, P.G. (1977). Mechanisms of Environment Sensitive Cracking in Glasses. Mechanisms of Environment Sensitive Cracking of Materials. The Metals Society, London, 268–282.
25. Freiman, S.W. (1975). Temperature dependence of crack propagation in glass in alcohols. Journal of the American Ceramic Society 58, 340–341.10.1111/j.1151-2916.1975.tb11496.x ↗
26. Freiman, S.W. (1974). Effect of alcohols on crack propagation in glass. Journal of the American Ceramic Society 57, 350–353.10.1111/j.1151-2916.1974.tb10920.x ↗
27. Freiman, S.W., Mulville, D.R. and Mast, P.W. (1973). Crack propagation studies in brittle materials. Journal of Materials Science 8, 1527–1533.10.1007/BF00754886 ↗
28. Fukuzawa, I., Ishiguro, S. and Nanbu, S. (1985). Moisture resistance degradation of plastic LSI's by reflow soldering. Proceedings of the IEEE International Reliability Physics Symposium, 192–197.10.1109/IRPS.1985.362097 ↗
29. Golike, R.C. and Lasoski, S.W. (1960). Kinetics of hydrolysis of polyethylene terephthalate films. Journal of Physical Chemistry 64, 895–898.10.1021/j100836a018 ↗
30. Goodman, I. and Rhys, J.A. (1965). Polyesters. Vol. I: Saturated Polymers, The Chapel River Pres Ltd., UK.
31. Gledhill, R.A., Kinloch, A.J. and Shaw, S.J. (1980). A model for predicting joint durability, Journal of Adhesion 11, 3–15.10.1080/00218468008078901 ↗
32. Gurumurthy, C.K. and Kramer, E.J. (1999a). Unpublished results: Data for moisture concentration along epoxy/polyimide interface obtained using the cold stage facility of dynamic secondary ion mass spectroscopy (SIMS).
33. Gurumurthy, C.K., and Kramer, E.J. (1999b). Unpublished results: We converted a small thickness of the polyimide surface into polyamic acid by first hydrolyzing the polyimide with 1M tetramethyl ammonium hydroxide (TMAH) followed by an ion-exchange in 1M acetic acid. The acid functional groups created can chemically bond to the epoxy functional groups of the model underfill epoxy. A thin layer of the model underfill epoxy was spin cast in solution (N-methyl pyrolidone was used as the solvent) on top of the surface modified polyimide to improve the interpenetration of the epoxy chains inside the polyamic acid matrix. Model underfill epoxy was then flowed on top of the spuncast layer to form the underfill beam of our sample.
34. Gurumurthy, C.K., and Kramer, E.J. (1999c). Unpublished results:We floated a thin layer of polystyrene on top of our fracture surfaces and conducted secondary ion mass spectroscopy on them. The polystyrene acts as a guard layer so that the ion beam damage is stabilized by the time it reaches our sample surface. The model underfill epoxy generates very little CN-signal coming from the nitrogen element present in the catalyst used in curing this system. However, there is a very strong CN-signal from the imide rings of the polyimide. Hence, if a trace (larger than the resolution of the SIMS machine ~ 10 nm) of epoxy or polyimide is found on either side of the fracture surface, we can detect it. Our experiments have clearly shown that the crack proceeds along the interface.
35. Gurumurthy, C.K., Jiao, J., Norris, L.G., Hui, C.Y. and Kramer, E.J. (1998). A thermo-mechanical approach for fatigue testing of polymer bimaterial interfaces. The transactions of the ASME, Journal of Electronic packaging 120, 372–378.10.1115/1.2792649 ↗
36. Gurumurthy, C.K., Norris, L.G., Hui, C.Y. and Kramer, E.J. (1998). Characterization of underfill/passivation interfacial adhesion for direct chip attach assemblies using fracture toughness and hydro-thermal fatigue measurements. The 48th Electronics Components and Technology Conference (ECTC), Seattle, 721–728.10.1109/ECTC.1998.678778 ↗
37. Hartley, N.E.W. and Wilshaw, T.R. (1973). Deformation and fracture of synthetic α-quartz. Journal of Materials Science 8, 265–278.10.1007/BF00550676 ↗
38. Hawkins, G., Ganesan, G., Lewis, G. and Berg, H. (1994). The PBGA: A systematic study of moisture resistance. Proceedings of the IEPS Conference, 588–602.
39. Helfinstine, J.D., Gulati, S.T., Pickles, D.G (1992). Slow crack growth in high-silica glasses. Physics of Non-Crystalline Solids, (Edited by Pye, L.D., La Course, W.C., Stevens, H.J.), Taylor & Francis, U.K., 654–658.
40. Hillig, W.B. and Charles, R.J. (1962). Surfaces, stress-dependent surface reactions, and strength. High-Strength Materials (Edited by Zackey, V.F.), John Wiley and Sons Inc., New York, 682–705.
41. Holubka, J.W. and Chun, W. (1988). Evaluation of adhesively bonded composite/metal bonds in simulated automotive service environments. Adhesives, sealants, and coatings for space and harsh environments (Edited by Lee, L-H) Polymer science and technology 37, Plenum Press, New York, 213–225.
42. Houghten, J. and Freyman, B., Shim, I.K., Youm, D.S., Heo, Y.W. and Lee, M.E. (1994). Reduction in popcorn effects in plastic BGA's. Proceedings of the IEPS Conference, 603–611.
43. Hubbell, W.H. and Munir, Z.A. (1975). Transient and steady-state water vapor permeation through polymer films. Journal of Polymer Science: Polymer physics Edition 13, 493–507.
44. IPC (1995). Procedure for characterizing and handling of moisture/reflow sensitive IC's. IPC StandardIPC-SM-786A.
45. Ito, S. and Tomozawa, M. (1981). Stress corrosion of silica glass. Journal of The American Ceramic Society 64, C160.
46. Jacobs, L. (1997). Technology gaps and research needs in electronic packaging-An industry perspective. Presentation at Cornell Industry Alliance for Electronic Packaging. Cornell University, New York.
47. JEDEC (1995). Preconditioning of plastic surface mount devices prior to reliability testing. JEDEC Standard JESD22-A113-A.
48. JEDEC (1995). Moisture-induced stress sensitivity for plastic surface mount devices. JEDEC Standard EIA/JESD22-A112-A.
49. JEDEC (1994). Moisture induced stress sensitivity for plastic packaged surface mount devices. JEDEC Standard JESD22-A112.
50. JEDEC (1991). Accelerated moisture resistance-unbiased autoclave. JEDEC Standard JESD22-A102B.
51. JEDEC (1989). Temperature cycling. JEDEC Standard JESD22-A104-A.
52. JEDEC (1989). Cycled temperature humidity bias life test. JEDEC Standard JESD22-A100-A.
53. JEDEC (1988). Highly-accelerated temperature and humidity stress test (HAST). JEDEC Standard 22-A110.
54. JEDEC (1988). Steady-state temperature humidity bias life test. JEDEC Standard 22-A101-A
55. Jiao, J., Gurumurthy, C.K., Kramer, E.J., Sha, Y., Hui, C.Y. and Borgesen, P. (1998). Measurement of Interfacial Fracture Toughness under Combined Mechanical and Thermal Stresses. The Transactions of the ASME, Journal of Electronic Packaging 120, 349–353.10.1115/1.2792645 ↗
56. Jiao, J., Gurumurthy, C.K., Kramer, E.J., Sha, Y., Hui, C.Y. and Borgesen, P. (1996). Unpublished results on fracture toughness measurements along commercial underfill/commercial polyimide passivation interfaces.
57. Kinloch, A.J. (1987). Adhesion and Adhesives: Science and Technology, Chapman and Hall, U.K.10.1007/978-94-015-7764-9 ↗
58. Kinloch, A.J., Welch, L.S. and Bishop, H.E. (1984). The locus of environmental crack growth in bonded aluminium alloy joints, Journal of Adhesion 16, 165–178.10.1080/00218468408074915 ↗
59. Kanninen, M.F. (1973). An Augmented Double Cantilever Beam Model for Studying Crack Propagation Arrest. International Journal of Fracture 9, 83–92.10.1007/BF00035958 ↗
60. Krausz, A.S. (1978). The deformation and fracture kinetics of stress corrosion cracking. International Journal of Fracture 14, 5–15.10.1007/BF00032381 ↗
61. Krausz, A.S. (1979). The theory of thermally activated processes in brittle stress corrosion cracking. Engineering Fracture Mechanics 11, 33–42.10.1016/0013-7944(79)90027-4 ↗
62. Landrock, A.H. (1985). Adhesive Technology Handbook, Noyes Publication, NJ, 251–253.
63. Lau, J., Chang, C. and Chen, R. (1997). Effects of underfill encapsulant on the mechanical and electrical performance of a functional flip chip device. Journal of Electronics Manufacturing 7, 269–277.10.1142/S0960313197000282 ↗
64. Lau, J. (1996). Flip Chip Technologies, McGraw Hill, New York.
65. Lee, L-H. (1988). Adhesives, sealants and coatings for space and harsh environments. Adhesives, Sealants and Coatings for Space and Harsh Environments (Edited by Lee, L.H.) Plenum Press, New York, 5–29.10.1007/978-1-4613-1047-1_2 ↗
66. Lin, R., Blackshear, E. and Serisby, P. (1988). Moisture induced package cracking in plastic encapsulated surface mount components during solder reflow process. Proceedings of the IEEE IRPS, 83–89.10.1109/RELPHY.1988.23431 ↗
67. Maugis, D. (1985). Subcritical crack growth, surface energy, fracture toughness, stick-slip and embrittlement, Journal of Materials Science 20, 3041–3073.10.1007/BF00545170 ↗
68. Mecholsky, J.J., Gonzalez, A.C. and Freiman, S.W. (1979). Fractographic analysis of delayed failure in soda-lime glass. Journal of the American Ceramic Society 62, 577–580.10.1111/j.1151-2916.1979.tb12735.x ↗
69. Mai, Y.W. (1976). Temperature and rate dependent fracture in glass-filled polystyrene. Polymer Engineering and Science 16, 400–405.10.1002/pen.760160604 ↗
70. Matz, D.J., Guldemond, W.G. and Cooper, S.L. (1972). Delayed yielding in glassy polymers. Journal of Polymer Science 10, 1917–1930.
71. Michalske, T.A. and Bunker, B.C. (1993). A chemical kinetics model for glass fracture. Journal of American Ceramic Society 76, 2613–2618.10.1111/j.1151-2916.1993.tb03989.x ↗
72. Mostovoy, S. and Ripling, E.J. (1975). Flaw tolerance of a number of commercial and experimental adhesives. Polymer Science and Technology, Vol. 9B (Edited by Lieng-Huang, L) Plenus Press, New York 513–562.
73. Mostovoy, S. and Ripling, E.J. (1969). Influence of water on stress corrosion cracking of epoxy bonds. Journal of Applied Polymer Science 13, 083–1111.10.1002/app.1969.070130602 ↗
74. Nadeau, J.S. (1974). Subcritical crack growth in vitreous carbon at room temperature. Journal of The American Ceramic Society 57, 303–306.10.1111/j.1151-2916.1974.tb10906.x ↗
75. NTRS (1997). National Technology Roadmap for Semiconductors-Technology Needs. Semiconductor Industry Association.
76. Ooij, W.J.V. (1985). Metal-Polymer interfaces, industrial adhesion problems, Industrial Adhesion problems (Edited by Brewis, D.M., Briggs, D.) John wiley and Sons, New York, 87–127.
77. Papathomas, K.I. (1997). Polymers in Packaging and Interconnection Technology. Presentation at Cornell University, New York.
78. Perutz, S., Kramer, E.J., Baney, J., Hui, C.Y. and Cohen, C. (1998). Investiagation of adhesion hysterisis in poly (dimethylsiloxane) networks using the JKR technique. Journal of Polymer Science: Part B: Polymer Physics 36, 2129–2139.10.1002/(SICI)1099-0488(19980915)36:12<2129::AID-POLB11>3.0.CO;2-1 ↗
79. Plueddemann, E.P. (1982). Silane Coupling Agents, Plenum Press, New York.10.1007/978-1-4899-0342-6 ↗
80. Pollet, J.-C. and Burns, S.J. (1977). Thermally activated crack propagation-theory. International Journal of Fracture 13, 667–679.10.1007/BF00017299 ↗
81. Ravens, D.A.S. and Ward, I.M. (1961). Chemical reactivity of polyethylene terephthalate, Transaction: Faraday Society 57, 151–159.
82. Rice, J. R. (1988). Elastic fracture mechanics concepts for interfacial cracks. Journal of Applied Mechanics 55, 98–103.10.1115/1.3173668 ↗
83. Richter, H. (1977). The physics of Non-Crystalline Solids (Edited by Frischat, G.H.) Trans Tech Publications, Switzerland, 618–624.
84. Ripling, E.J. Bersch, C. and Mostovoy, S. (1971). Stress corrosion cracking of adhesive joints. Journal of Adhesion 3, 145–163.10.1080/00218467108081160 ↗
85. Ritter, J.E., Fox. J.R., Hutko, D.I. and Lardner, T.J. (1998). Moisture-assisted crack growth at epoxy-glass interfaces. Journal of Materials Science 33, 4581–4588.10.1023/A:1004477006957 ↗
86. Sacher, E. and Susko, J.R. (1981). Water permeation of polymer films. III. High temperature polyimides, Journal of Applied Polymer Science 26, 679–686.10.1002/app.1981.070260226 ↗
87. Sha, Y., Hui, C. Y., Kramer, E.J., Hahn, S. F. and Berglund, C. A. (1996). Fracture Toughness and Failure Mechanism of Epoxy/Rubber-Modified Polystyrene (HIPS) Interfaces Reinforced by Grafted Chains. Macromolecules 29, 4728–4736.10.1021/ma951794i ↗
88. Shoeck, G. (1990). Thermally activated crack-propagation in brittle materials. International Journal of Fracture 44, 1–14.10.1007/BF00012548 ↗
89. Simmons, C.J. and Freiman, S.W. (1981). Effect of corrosion processes on subcritical crack growth in glass. Journal of The American Ceramic Society 64, 683–686.10.1111/j.1151-2916.1981.tb15870.x ↗
90. Suo, Z. and Hutchinson, J. W. (1990). Interface Crack Between Two Elastic Layers. International Journal of Fracture 43, 1–18.10.1007/BF00018123 ↗
91. Suryanarayana, D., Wu, T.Y. and Varcoe, J.A. (1993). Encapsulants used in flip-chip packages. IEEE Transactions on Components, Hybrids, and Manufacturing Technology 16, 858–862.10.1109/33.273685 ↗
92. Suryanarayana, D.; Hsiao, R.; Gall, T.P. and McCreary, J.M. (1991). Enhancement of flip-chip fatigue life by encapsulation. IEEE Transactions on Components, Hybrids, and Manufacturing Technology 14, 218–223.10.1109/33.76536 ↗
93. Tonneau, A., Henaff, G., Mabru, C. and Petit, J. (1998). Environmentally-assisted fatigue crack propagation in aluminides at room temperature. Scripta Materialia 39, 1503–1508.10.1016/S1359-6462(98)00347-9 ↗
94. Tummala, R. and Ramasawsky, E.J. (1989). Handbook of Microelectronic Packaging. Von Nostrand Reinhold, New York.
95. Wang, D.W. and Papathomas, K.I. (1993). Encapsulant for fatigue life enhancement of controlled-collapse chip connection (C4). IEEE Transactions on Components, Hybrids, and Manufacturing Technology 16, 863–867.10.1109/33.273686 ↗
96. Weidmann, G.W. and Holloway, D.G. (1974)/ Slow crack propagation in glass. Physics and Chemistry of Glasses 15, 116–122.
97. Weidmann, G.W. and Holloway, D.G. (1974). Plastic flow-slow crack propagation and static fatigue in glass. Physics and Chemistry of Glasses 15, 68–75.
98. White, L. and Suryanarayana, D. (1994). Flip Chip Encapsulation for MCM-L. Proceedings-NEPCON West 1994 III, Anaheim, CA, 2292–2301.
99. Wiederhorn, S.M. (1975) Crack growth as an interpretation of static fatigue. Journal of Non-Crystalline Solids 19, 169–181.10.1016/0022-3093(75)90083-6 ↗
100. Wiederhorn, S.M. (1967). Influence of water vapor on crack propagation in soda-lime glass. Journal of The American Ceramic Society 50, 407–414.10.1111/j.1151-2916.1967.tb15145.x ↗