Surface effects on delamination of a thin film bonded to an elastic substrate
Source abstract
Abstract
The delamination of a circular thin film at micro/nanoscale is studied using the Kirchhoff plate theory incorporating surface effects in this paper. Bending of a clamped circular nanoplate subjected to a concentrated force at the center or a uniformly distributed force over a lateral surface is solved. The bending deflection is derived in closed form. The adhesion energy and its release rate for delamination are determined when surface effects are taken into account. The influences of surface residual stress and surface elasticity along with the film’s size on the energy release rate of debonding advance or interfacial adhesion of a thin film bonded to an elastic substrate are analyzed for applied loading or given displacements. Analytic results are compared with experimental data and satisfactory agreement is confirmed.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Nonlocal and gradient elasticity in micro/nano structures · Mechanical Behavior of Composites · Numerical methods in engineering
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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