Influence of sintering process on high temperature cyclic deformation behavior and fatigue creep damage mechanism of sintered silver
Bibliographic record
Abstract
No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.
Source: Not provided · Quality: missing
Research context
OpenAlex topics: Aluminum Alloys Composites Properties · Powder Metallurgy Techniques and Materials · Advanced materials and composites
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (37)
Show source-provided references
1. “Planar common-mode EMI filter design and optimization for high-altitude 100-kW SiC inverter/rectifier system”, IEEE10.1109/JESTPE.2022.3144691 ↗
2. The role of power device technology in the electric vehicle powertrain10.1002/er.8581 ↗
3. K. Yang, L. Zhou, F. Wu, G. Yang, L. Ding, K. Li, and X. Li, “Simulation of crack propagation in solder layer of IGBT device under temperature shock by viscoplastic phase field method,” Eng. Fract. Mech., vol. 284, May 2023, Art. no. 109260.10.1016/j.engfracmech.2023.109260 ↗
4. Microstructural response of highly porous sintered nano-silver particle die attachments to thermomechanical cycling10.1007/s11664-023-10870-4 ↗
5. D. Kim and M. S. Kim, “Macroscale and microscale structural mechanisms capable of delaying the fracture of low-temperature and rapid pressureless Ag sintered electronics packaging,” Mater. Charact., vol. 198, Apr. 2023, Art. no. 112758.10.1016/j.matchar.2023.112758 ↗
6. J. Dai, J. Li, P. Agyakwa, M. Corfield, and C. M. Johnson, “Shear strength of die attachments prepared using dry nanosilver film by a time-reduced sintering process,” Microelectron. Reliab., vol. 111, Aug. 2020, Art. no. 113740.10.1016/j.microrel.2020.113740 ↗
7. Experimental investigation on the sintering kinetics of nanosilver particles used in high power electronic packaging10.1109/TCPMT.2020.2995634 ↗
8. D. Yang, Y. Huang, and Y. Tian, “Microstructure of Ag nano paste joint and its influence on reliability,” Crystals, vol. 11, no. 12, Dec. 2021, Art. no. 1537.10.3390/cryst11121537 ↗
9. S. Zhao, Y. Dai, F. Qin, Y. Li, T. An, and Y. Gong. “Effect of surface finish metallization layer on shearing fracture toughness of sintered silver bonded joints,” Eng. Fract. Mech., vol. 264 Apr. 2022, Art. no. 108355.10.1016/j.engfracmech.2022.108355 ↗
10. SiC chip attachment sintered by nanosilver paste and their shear strength evaluation10.1007/s40194-019-00736-x ↗
11. Elastoplastic nanoindentation behaviors of sintered nano-silver under various sintering parameters10.1108/SSMT-12-2023-0076 ↗
12. S. Zhao, Y. Dai, F. Qin, Y. Li, L. Liu, Z. Zan, T. An, P. Chen, Y. Gong, and Y. Wang, “On mode II fracture toughness of sintered silver based on end-notch flexure (ENF) test considering various sintering parameters,” Mater. Sci. Eng. A., vol. 823, Aug. 2021, Art. no. 141729.10.1016/j.msea.2021.141729 ↗
13. Microstructures and mechanical properties of bulk nanocrystalline silver fabricated by spark plasma sintering10.1557/jmr.2016.212 ↗
14. Structure and mechanical properties of nanocrystalline silver prepared by spark plasma sintering10.1016/j.msea.2019.03.101 ↗
15. L. Gao, S. Zou, C. Zheng, and D. Mu, “Microstructure and bonding strength of Low-Temperature sintered Ag/Nano-Ag Films/Ag joints,” Metals, vol. 13, Oct. 2023, Art. no. 1833.10.3390/met13111833 ↗
16. Rapid formation of Cu–Cu joints with high shear strength using multiple-flocculated Ag nanoparticle paste
17. P. Fan, W. Zhang, X. Yu, and G. Gan, “High-conductivity flexible Ag films formed by low-temperature and short-time sintering of PVP-modified silver oxalate composite ink,” Mater. Res. Express., vol. 9, no. 1, Jan. 2022, Art. no. 016303.10.1088/2053-1591/ac487f ↗
18. Y. J. Kim, B. H. Park, S. K. Hyun, and H. Nishikawa, “The influence of porosity and pore shape on the thermal conductivity of silver sintered joint for die attach,” Mater. Today Commun., vol. 29, Dec. 2021, Art. no. 102772.10.1016/j.mtcomm.2021.102772 ↗
19. The pressureless sintering of micron silver paste for electrical connections10.1016/j.jallcom.2019.04.270 ↗
20. Effect of sintering atmospheres on printed silver nanoparticle patterns for flexible electronics application10.1007/s00339-021-04923-w ↗
21. Reliability and characterization of nanosilver joints prepared by a time-reduced sintering process10.1109/TDMR.2021.3118323 ↗
22. M. Wang, W. Wang, L. Han, J. Chen, Y. Chen, Y. Wu, Y. Zhao, “Effect of sintering time on the characteristics of YBCO coated-conductor joints using nano-silver paste,” Phys. C Supercond. vol. 620, May 2024, Art. no. 1354485.10.1016/j.physc.2024.1354485 ↗
23. S. T. Feng, Y. H. Mei, C. Gang, X. Li, and G. Q. Lu. “Characterizations of rapid sintered nanosilver joint for attaching power chips,” Materials, vol. 9, no. 7, Jul 2016, Art. no. 564.10.3390/ma9070564 ↗
24. The influence of processing conditions on the 3-D interconnected structure of nanosilver paste10.1109/TED.2016.2639363 ↗
25. Low-temperature sintering behavior (≤ 400° C) of micro-sized silver particles decorated by silver nanoparticles through surface iodination10.1007/s11664-018-6400-9 ↗
26. Mechanical property and reliability of bimodal nano-silver paste with Ag-coated SiC particles10.1108/SSMT-05-2018-0014 ↗
27. F. Wang, H. Zhu, and H. He. “Low temperature sintering of Ag nanoparticles/graphene composites for paper based writing electronics,” J. Phys. D: Appl. Phys. vol. 49, no. 41, Sep. 2016, Art. no. 415501.10.1088/0022-3727/49/41/415501 ↗
28. Enhanced mechanical and thermal properties of Ag joints sintered by spark plasma sintering10.1007/s11664-022-09849-4 ↗
29. Pressure sintering of micro-silver joints in SiC power devices: optimization of processing parameters and FEM analysis10.1007/s11664-023-10822-y ↗
30. Fabrication of highly conductive and flexible printed electronics by low temperature sintering reactive silver ink10.1016/j.apsusc.2018.07.187 ↗
31. Parametric study on conductive patterns by low-temperature sintering of micron silver ink10.1039/D2RA07889A ↗
32. A predictive model for thermal conductivity of nano-Ag sintered interconnect for a SiC die10.1007/s11664-019-06984-3 ↗
33. Power module using ceramic heat sink and multilayers silver sintering
34. Pressureless sintered-silver die-attach at 180 ℃ for power electronics packaging10.1109/TPEL.2021.3074853 ↗
35. Y. Yao, and H. Gong, “Damage and viscoplastic behavior of sintered nano-silver joints under shear loading,” Eng. Fract. Mech., vol. 222, Dec. 2019, Art. no. 06741.10.1016/j.engfracmech.2019.106741 ↗
36. Thermal shock life prediction of the SiC wide bandgap power module semiconductor package considering creep behavior of the Ag sintered interconnect and viscoelastic properties of the epoxy molding compound10.1021/acsaelm.3c00763 ↗
37. B. Tang, H. Li, N. Guo, H. Zhang, G. Liu, X. Li, and Y. Zuo, “Revealing ductile/quasi-cleavage fracture and DRX-affected grain size evolution of AA7075 alloy during hot stamping process,” Int. J. Mech. Sci., vol. 212, no. 15, Dec. 2021, Art. no. 106843.10.1016/j.ijmecsci.2021.106843 ↗