Evaluation of structural design methodologies for predicting mechanical reliability of solder joint of BGA and TSSOP under launch random vibration excitation
Source abstract
Abstract
Abstract The fatigue damage that accumulates on a solder joint under a launch vibration environment is a major cause of failure in spaceborne electronics. Thus, predicting the mechanical safety of the solder joint in the structural design phase is important to guarantee a successful space mission. This paper proposes a mechanical design methodology to predict and ensure more reliable mechanical safety of the solder joints of a plastic ball grid array (PBGA) and a thin-shrink small outline package (TSSOP) under launch random vibration excitation. Random vibration fatigue tests for a sample printed circuit board (PCB) assembly were performed to assess the fatigue life of BGA and TSSOP solder joints. The effectiveness of the proposed structural design methodologies was evaluated by comparing the margin of safety calculated from various analysis approaches and the random vibration fatigue test results of the PCB specimen.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Advanced Sensor Technologies Research · Advanced MEMS and NEMS Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (22)
Show source-provided references
1. de Rooij NF, Gautsch S, Briand D, Marxer C, Mileti G, Noell W, Shea H, Staufer U, and van der Schoot B. MEMS for Space. in: Proceedings of 2009 International Solid-State Sensors, Actuators and Microsystems Conference. 2009:17–24.10.1109/SENSOR.2009.5285575 ↗
2. Ardebili · 2009
3. Ball Grid Array Reliability Assessment for Aerospace Applications10.1016/S0026-2714(98)00185-1 ↗
4. Helvajian · 1999
5. Steinberg · 2000
6. Wong TE, Reed BA, Cohen HM and Chu DW. Development of BGA Solder Joint Vibration Fatigue Life Prediction Mode. in: Proceedings of 49th Electronic Components and Technology Conference 1999:149–154.10.1109/ECTC.1999.776163 ↗
7. Vibration-induced fatigue life estimation of ball grid array packaging10.1088/0960-1317/19/6/065005 ↗
8. Virtual remaining life assessment of electronic hardware subjected to shock and random vibration life cycle loads
9. High-cycle fatigue life prediction for Pb-free BGA under random vibration loading10.1016/j.microrel.2010.10.003 ↗
10. Fatigue life estimations of solid-state drives with dummy solder balls under vibration10.1016/j.ijfatigue.2016.03.016 ↗
11. PBGA packaging reliability assessments under random vibrations for space applications10.1016/j.microrel.2014.09.022 ↗
12. Structural vibration analysis of electronic equipment for satellite under launch environment10.4028/www.scientific.net/KEM.270-273.1440 ↗
13. Structural design and analysis of 1U Standardized STEP cube lab for on-orbit verification of fundamental space technologies
14. Improving the reliability in the next generation of US army platforms through physics of failure analysis10.1007/s11668-011-9532-2 ↗
15. Beda MG. A Curvature-based Interpretation of the Steinberg Criterion for Fatigue Life of Electronic Components in: Proceedings of 48th Annual International Symposium on Microelectronics, 2015;1:1–6.10.4071/isom-2015-THA63 ↗
16. McLeish J. and Blattau N. CAE Apps for Physics of Failure Reliability & Durability Simulations in: 60th IEEE Annual Reliability and Maintainability Symposium (RAMS), 2014:1–6.10.1109/RAMS.2014.6798444 ↗
17. Perkins A, and Sitaraman SK. A Study into the Sequencing of Thermal Cycling and Vibration Tests. in: Proceedings of 58th IEEE Electronic Components and Technology Conference 2008:584–592.10.1109/ECTC.2008.4550032 ↗
18. 17 Equations that changed the world – There’s More Than That!!! Part 1
19. IPC-WP-011. Guidance for Strain Gage Limits for Printed Circuit Assemblies. Association Connecting Electronics Industries, (2011) 1–4.
20. De Clerck · 2016
21. Grieu M, Maire O, Massiot G, Munier C, Bienvenu Y, and Renard J. Sn3.0AgO.5Cu Solder Joints Lifetime Estimation for Electronic Assemblies under Random Vibration. in: 2nd IEEE Electronics Systemintegration Technology Conference. 2008:175–180.10.1109/ESTC.2008.4684345 ↗
22. Huaicheng L, Tong A, Tao T, and Fei Q. Vibration Reliability Test and Analysis of Plastic Ball Grid Array. in: 17th International Conference on Electronic Packaging Technology. 2016:1247–1250.10.1109/ICEPT.2016.7583350 ↗