Grain boundary sliding model for assessing creep-fatigue life of Sn37Pb eutectic solder
Source abstract
Abstract
Abstract This study discusses the creep-fatigue life prediction of eutectic Sn37Pb solder. Creep-fatigue lives were experimentally obtained at 313 K using fast-fast, slow-slow, slow-fast, fast-slow, and strain-hold waveforms. Conventional four creep-fatigue life prediction rules, time fraction rule, strain range partitioning method, frequency modified fatigue life, and ductility exhaustion model was used to predict the creep-fatigue lives. However, not all the rules were able to properly estimate them. Since the grain boundary sliding rates were closely related to creep-fatigue lives, a new life prediction method based on grain boundary sliding rates was proposed.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · High Temperature Alloys and Creep · Aluminum Alloy Microstructure Properties
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (33)
Show source-provided references
1. Solder joint fatigue models: review and applicability to chip scale packages10.1016/S0026-2714(99)00061-X ↗
2. Massiot G, Munier C. A review of creep fatigue failure models in solder material - simplified use of a continuous damage mechanical approach. 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the, 2004, p. 465–72. https://doi.org/10.1109/ESIME.2004.1304079.10.1109/ESIME.2004.1304079 ↗
3. Review of methods to predict solder joint reliability under thermo-mechanical cycling10.1111/j.1460-2695.2006.01065.x ↗
4. Creep fatigue models of solder joints: a critical review10.1016/j.microrel.2016.01.013 ↗
5. A state-of-the-art review of fatigue life prediction models for solder joint
6. Isothermal fatigue of low tin lead based solder10.1007/BF02628389 ↗
7. Effect of strain rate on fatigue of low-tin lead-base solder10.1109/33.49003 ↗
8. Energy approach to the fatigue of 60/40 Solder: Part I—influence of temperature and cycle frequency10.1115/1.2792079 ↗
9. Low cycle fatigue analysis of temperature and frequency effects in eutectic solder alloy10.1016/S0142-1123(99)00124-3 ↗
10. Low cycle fatigue behavior and mechanisms of a eutectic Sn–Pb solder 63Sn/37Pb10.1016/S0142-1123(01)00186-4 ↗
11. A unified equation for creep-fatigue10.1016/j.ijfatigue.2014.05.004 ↗
12. Creep-integrated fatigue equation for metals10.1016/j.ijfatigue.2016.11.030 ↗
13. Energy approach to the fatigue of 60/40 Solder: Part II— influence of hold time and asymmetric loading10.1115/1.2792134 ↗
14. Creep-fatigue life prediction of in situ composite solders10.1007/BF02669454 ↗
15. Environmental and hold time effects on fatigue of low-tin lead-based solder10.1007/BF02656804 ↗
16. Grain boundary sliding in as-cast Pb-Sn eutectic10.1016/0956-716X(94)90341-7 ↗
17. Strain-rate effects on low cycle fatigue mechanism of eutectic Sn–Pb solder10.1016/S0142-1123(02)00011-7 ↗
18. Creep-fatigue interactions in eutectic tin-lead solder alloys10.1520/STP23914S ↗
19. Lifetime of structures subjected to varying load and temperature10.1007/978-3-642-86014-0_6 ↗
20. Effect of temperature variation on the long-time rupture strength of steels
21. Fatigue at high temperature
22. Creep-fatigue analysis by strain-range partitioning
23. Ductility exhaustion model for prediction of thermal fatigue and creep interaction10.1520/STP38874S ↗
24. The Society of Materials Science Japan. Standard Creep-Fatigue Testing for Solders. JSMS-SD-9-04 2004.
25. The Society of Materials Science, Japan. Standard Testing for High Temperature Low Cycle Fatigue; 2019. http://www.jsms.jp/book/koonlowcycle.htm (accessed June 30, 2020).
26. A Strain rate ratio approach for assessing creep-fatigue life of 63Sn-37Pb solder under shear loading10.1115/1.2070091 ↗
27. Effect of temperature and strain rate on mechanical properties of Sn-Pb solders10.1299/kikaia.65.901 ↗
28. Effect o environment on partitioned strain-life relations of SUS 304 stainless steel
29. Creep behavior and deformation mechanism map of Sn-Pb eutectic solder alloy10.1115/1.1525254 ↗
30. Creep and creep rupture of 63 Sn-37 Pb solder10.1299/kikaia.66.589 ↗
31. Japan Society of Materials Science. Factual Database on Creep and Creep-Fatigue Properties of Sn-37Pb and Sn-3.5Ag Solders. Japan Society of Materials Science; 2004.
32. Creep-fatigue life evaluation for Sn-3.5Ag solder10.1115/1.2172273 ↗
33. Effect of strain waveform on creep-fatigue life for Sn–8Zn–3Bi solder10.1111/j.1460-2695.2007.01129.x ↗