Fatigue behaviour analysis of thermal cyclic loading for through-silicon via structures based on backstress stored energy density
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OpenAlex topics: Advanced Surface Polishing Techniques · 3D IC and TSV technologies · Advanced ceramic materials synthesis
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References (56)
Show source-provided references
1. Finite element analysis of vertical micro-probe considering joule-heating effect10.1016/j.ijfatigue.2017.02.021 ↗
2. Vertical traversal approach towards TSVs optimisation over multilayer network on chip (NoC)
3. Effect of temperature cycling on the leakage mechanism of TSV liner10.1016/j.microrel.2022.114889 ↗
4. A universal and efficient equivalent modeling method for thermal analysis of 3D ICs containing tapered TSVs10.1016/j.icheatmasstransfer.2022.106161 ↗
5. Reliable single-phase micro-joints with high melting point for 3D TSV chip stacking10.1016/j.jallcom.2020.154468 ↗
6. Performance evaluation of noise coupling on germanium based TSV filled material for future IC integration technique
7. Interval optimal design of 3-D TSV stacked chips package reliability by using the genetic algorithm method10.1016/j.microrel.2014.08.018 ↗
8. inhibiting the detrimental cu protrusion in cu through-silicon-via by highly (111)-oriented nanotwinned cu10.1016/j.scriptamat.2021.113782 ↗
9. Impact of TSV bump and redistribution layer on crosstalk delay and power loss
10. Experimental research on performance degradation of TSV microstructure under thermal cycling, vibration and electrical stress10.1016/j.microrel.2022.114643 ↗
11. Evaluation of crack propagation behaviors in a t-shaped tubular joint employing tetrahedral FE modeling10.1016/j.ijfatigue.2016.11.028 ↗
12. Numerical analysis of thermo-mechanical reliability of through silicon vias (TSVs) and solder interconnects in 3-dimensional integrated circuits10.1016/j.mee.2009.07.022 ↗
13. Impact of Near-Surface thermal stresses on interfacial reliability of Through-Silicon vias for 3-D interconnects10.1109/TDMR.2010.2068572 ↗
14. 4-Stress and reliability analysis for interconnects10.1016/B978-0-08-102532-1.00004-4 ↗
15. Low temperature interfacial reaction in 3D IC nanoscale materials
16. Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric10.1016/j.microrel.2012.06.021 ↗
17. Tang gong yue. Effects of TSVs (through-silicon vias) on thermal performances of 3D IC integration system-in-package (SiP)10.1016/j.microrel.2012.04.002 ↗
18. Optimization of the thermal reliability of a four-tier die-stacked SiP structure using finite element analysis and the taguchi method10.1016/j.mejo.2018.01.011 ↗
19. Fatigue behavior of 3D stacked packaging structures under extreme thermal cycling condition
20. Study on copper protrusion of through-silicon via in a 3-D integrated circuit10.1016/j.msea.2019.03.130 ↗
21. Effect of copper TSV annealing on via protrusion for TSV wafer fabrication10.1007/s11664-012-2117-3 ↗
22. Effect of silicon anisotropy on interfacial fracture for three dimensional through-silicon-via (TSV) under thermal loading10.1016/j.engfracmech.2019.01.030 ↗
23. In situ scanning transmission electron microscopy observations of fracture at the atomic scale10.1103/PhysRevLett.125.246102 ↗
24. the role of twinning deformation on the hardening response of polycrystalline magnesium from discrete dislocation dynamics simulations10.1016/j.actamat.2015.03.039 ↗
25. Effects of twin boundary orientation on plasticity of bicrystalline copper micropillars: A discrete dislocation dynamics simulation study10.1016/j.actamat.2019.07.007 ↗
26. A critical review on molecular dynamics applied to structure fracture and failure analysis10.1016/j.enganabound.2023.02.028 ↗
27. Anisotropic microstructure, properties and molecular dynamics simulation of CoCrNi medium entropy alloy fabricated by laser directed energy deposition10.1016/j.msea.2023.144834 ↗
28. Discrete dislocation plasticity analysis of the high-temperature cyclic response of composites10.1016/j.msea.2017.12.034 ↗
29. Hybrid discrete dislocation models for fatigue crack growth10.1016/j.ijfatigue.2009.10.015 ↗
30. On elastic gaps in strain gradient plasticity: 3D discrete dislocation dynamics investigation
31. Microstructure evolution and mechanical behavior of copper through-silicon via structure under thermal cyclic loading10.1016/j.microrel.2022.114730 ↗
32. Effects of anisotropy on the reliability of TSV microstructure10.1016/j.microrel.2020.113745 ↗
33. A review on the fatigue cracking of twin boundaries: Crystallographic orientation and stacking fault energy10.1016/j.pmatsci.2022.101011 ↗
34. The development of recrystallization textures in f.C.C. metals with a low stacking fault energy10.1016/0001-6160(75)90122-4 ↗
35. Microstructure based fatigue life prediction framework for polycrystalline nickel-base superalloys with emphasis on the role played by twin boundaries in crack initiation10.1016/j.actamat.2016.01.038 ↗
36. Dislocation density based crystal plasticity model incorporating the effect of precipitates in IN718 under monotonic and cyclic deformation10.1016/j.ijplas.2021.102990 ↗
37. the role of defects and critical pore size analysis in the fatigue response of additively manufactured IN718 via crystal plasticity10.1016/j.matdes.2018.04.022 ↗
38. Temperature- and rate-dependent deformation behaviors of SAC305 solder using crystal plasticity model10.1016/j.mechmat.2021.103834 ↗
39. H.M. Ledbetter, E.R. Naimon, Elastic properties of metals and alloys. II. Copper, J. Phys. Chem. Reference Data 3 (1974) 897–935.10.1063/1.3253150 ↗
40. Material parameters of copper and CuCrZr alloy for cyclic plasticity at elevated temperatures10.1016/j.jnucmat.2007.06.005 ↗
41. investigations of micro-notch effect on small fatigue crack initiation behaviour in nickel-based alloy GH4169: Experiments and simulations10.1016/j.ijfatigue.2020.105578 ↗
42. Examining metrics for fatigue life predictions of additively manufactured IN718 via crystal plasticity modeling including the role of simulation volume and microstructural constraints10.1016/j.msea.2020.139312 ↗
43. MANONUKUL A, DUNNE F P E. High and low-cycle fatigue crack initiation using polycrystal plasticity. Proceedings of the Royal Society. A, Mathematical, Physical, and Engineering Sciences 2004; 460(2047):1881-1903.10.1098/rspa.2003.1258 ↗
44. Microstructurally-sensitive fatigue crack nucleation in ni-based single and oligo crystals10.1016/j.jmps.2017.05.012 ↗
45. A conventional theory of mechanism-based strain gradient plasticity10.1016/j.ijplas.2003.08.002 ↗
46. Mixed mode crack paths in terms of plastic stress intensity factors based on conventional and strain gradient plasticity10.1016/j.prostr.2022.03.111 ↗
47. Coherency loss marking the onset of degradation in high temperature creep of superalloys: Phase-field simulation coupled to strain gradient crystal plasticity
48. Simulation of the Hall-Petch effect in FCC polycrystals by means of strain gradient crystal plasticity and FFT homogenization
49. On the characterization of geometrically necessary dislocations in finite plasticity10.1016/S0022-5096(00)00084-3 ↗
50. the effect of grain size on the stored energy of cold work as a function of strain for polycrystalline nickel
51. Xu Lu, Fionn P.E. Dunne, Yilun Xu. A crystal plasticity investigation of slip system interaction, GND density and stored energy in non-proportional fatigue in Nickel-based superalloy. Int J Fatigue 2020;139:105782.10.1016/j.ijfatigue.2020.105782 ↗
52. Fatigue cracking at twin boundaries: Effects of crystallographic orientation and stacking fault energy10.1016/j.actamat.2012.02.016 ↗
53. Stored energy density research on the fatigue crack initiation at twin boundary and life prediction of Inconel718 superalloy10.1016/j.ijfatigue.2023.107590 ↗
54. Twinning-induced dislocation and coordinated deformation behavior of a high-Nb TiAl alloy during high-cycle fatigue
55. High cycle fatigue behavior of high-Mn austenitic steel with deformation twins and twin boundary migration at 77 k10.1016/j.ijfatigue.2022.107390 ↗
56. Reconciling grain growth and shear-coupled grain boundary migration10.1038/s41467-017-01889-3 ↗