Research on thermal fatigue failure mechanism of BGA solder joints based on microstructure evolution
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Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Advanced Welding Techniques Analysis
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References (28)
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20. Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions10.1016/j.engfailanal.2021.105447 ↗
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