Constitutive Model for Sn–Pb Solder under Fatigue Loading
Source abstract
Abstract
The paper presents a constitutive model for Sn–Pb solder which captures the response of this complex material subject to a variety of load paths including fatigue loading. Internal state variables are established to characterize grain coarsening and material degradation observed experimentally. A damagecoupled viscoplastic constitutive model is formulated to take into account the effects of temperature and loading rates on mechanical response. The influence of fatigue loading frequency or strain rate, hold time, and temperature on mechanical behavior and fatigue life for 63Sn–37Pb solder alloy is examined. The fatigue failure predictions are compared with those obtained experimentally and found to be satisfactory.
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Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Metallurgy and Material Forming · Metal Forming Simulation Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Mechanical Engineering, University of Michigan-Dearborn, Dearborn, Michigan 48128, USA
Sandia National Laboratories, Albuquerque, NM 87185, USA
References (17)
Show source-provided references
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