Micro-Mechanics of Fatigue Damage in Pb-Sn Solder Due to Vibration and Thermal Cycling
Source abstract
Abstract
This paper presents a micro-mechanistic approach for modeling fatigue damage initiation due to cyclic plasticity and cyclic creep in eutectic Pb-Sn solder. The issue of damage evolution is deferred to a future paper. Fatigue damage model due to cyclic plasticity is modeled with dislocation mechanics. A conceptual framework is provided to quantify the influence of temperature on fatigue damage due to cyclic plasticity. Damage mechanics due to cyclic creep is modeled with a void nucleation model based on micro-structural stress fields. Micro-structural stress states are estimated under viscoplastic phenomena like grain boundary sliding and its blocking at second phase particles, and diffusional creep relaxation. A conceptual framework is provided to quantify the creep-fatigue damage due to thermo-mechanical cycling.
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Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Aluminum Alloys Composites Properties · Advanced Welding Techniques Analysis
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
CALCE Electronic Productsand Systems Consortium, University of Maryland, College Park, MD 20742
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