Anisotropic constitutive model coupled with damage for Sn-rich solder: Application to SnAgCuSb solder under tensile conditions
Abstract
Research context
OpenAlex topics: Metal Forming Simulation Techniques · Metallurgy and Material Forming · Electronic Packaging and Soldering Technologies
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Affiliations
Laboratory for Electronic Manufacturing and Packaging Integration, The Institute of Technological Sciences, Wuhan University, Wuhan, China
School of Power and Mechanical Engineering, Wuhan University, Wuhan, China
School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, China
School of Microelectronics, Wuhan University, Wuhan, China
College of Physics and Optoelectronic Engineering, Shenzhen University, Shenzhen, China
Indium Corporation of America, Utica, USA
Funding
National Key R&D Program of China · National Natural Science Foundation of China · Hubei Provincial Natural Science Foundation of China