Effect of substrate structures on the morphology and interfacial bonding properties of copper films sputtered on polyester fabrics
Source abstract
Abstract
Purpose The purpose of this paper is to discuss polyester fabric structures in terms of the surface morphology, crystal structure of copper films and interfacial bonding properties between polyester fabrics and copper films. Design/methodology/approach Nanoscale copper (Cu) thin films were deposited onto the surface of polyester fabrics with different structures by the radio frequency magnetron sputtering technique at room temperature. Findings Copper films uniformly deposited on the surface of the polyester nonwovens and nanofiber membranes have larger average particle diameters and surface roughness, and higher crystallinity. Originality/value Theoretical value: the effects of polyester substrate structures on the morphology and interfacial bonding properties of Cu thin films have rarely been reported.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Material Properties and Processing · Electronic Packaging and Soldering Technologies · Copper Interconnects and Reliability
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
Reference metadata was not supplied for this record.