Ni‐Cu‐Zn ferrites with high Curie temperature for multilayer inductors with increased operating temperatures
Source abstract
Abstract
Abstract We studied the sintering behavior and magnetic properties of Ni 0.60‐y Cu y Zn 0.42 Fe 1.98 O 3.99 ferrites. The shrinkage is shifted toward lower temperature with increasing Cu content y. The addition of Bi 2 O 3 sintering aid induces enhanced shrinkage at T < 900°C and dense ceramics are obtained after sintering at 900°C. Such ferrites exhibit a permeability of µ = 135‐250 depending on the composition, sintering temperature and concentration of sintering additive. Ferrites with y = 0.20 show a high Curie temperature of T c = 307°C. Multilayer inductors were fabricated and cofired at 900°C using ferrite tapes without and with 0.75 wt% Bi 2 O 3 . The compatibility of ferrite tapes with different metal pastes (Ag, AgPd, and Au) was evaluated. Ferrite tapes were also integrated between layers of low‐ k dielectric CT708 tapes and successfully cofired at 900°C. Preliminary tests indicate that the multilayer inductors can be operated up to temperatures of 250°C. This demonstrates that high‐T c Ni‐Cu‐Zn ferrites are promising magnetic materials for inductive components for high operating temperatures.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Multiferroics and related materials · Magnetic Properties and Synthesis of Ferrites · Ferroelectric and Piezoelectric Materials
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Dept. SciTec University of Applied Sciences Jena Jena Germany
Fraunhofer IKTS Hermsdorf Germany
Technical University Ilmenau Ilmenau Germany
References (31)
Show source-provided references
1. NomuraT NakanoA.New evolution of ferrites for multilayer chip components. Proc. of the Sixth International Conference on Ferrites Tokyo.1992;1198–201.
2. 10.1051/jp4:199712610.1051/jp4:1997126 ↗
3. 2000 K Yasuda Y Mochizuki M Takaya Multilayer ferrite chip component for growth of microelectronics 1162 4
4. Multilayer chip inductors
5. 10.1016/S0304-8853(02)00482-110.1016/S0304-8853(02)00482-1 ↗
6. 10.1007/s10832-005-3278-810.1007/s10832-005-3278-8 ↗
7. 10.1016/j.jmmm.2010.11.07110.1016/j.jmmm.2010.11.071 ↗
8. 10.1016/j.jmmm.2011.08.04010.1016/j.jmmm.2011.08.040 ↗
9. 10.1016/j.jmmm.2009.12.02910.1016/j.jmmm.2009.12.029 ↗
10. 10.1143/JJAP.38.350810.1143/JJAP.38.3508 ↗
11. 10.1023/B:JMSE.0000024230.90882.ff10.1023/B:JMSE.0000024230.90882.ff ↗
12. 10.1007/s10832-006-6362-910.1007/s10832-006-6362-9 ↗
13. 10.1007/s11664-020-08047-410.1007/s11664-020-08047-4 ↗
14. 10.1016/j.mseb.2009.01.03010.1016/j.mseb.2009.01.030 ↗
15. 10.2497/jjspm.61.S24210.2497/jjspm.61.S242 ↗
16. 10.1109/TMAG.2018.279243310.1109/TMAG.2018.2792433 ↗
17. 10.1111/ijac.1230810.1111/ijac.12308 ↗
18. https://product.tdk.com/info/en/products/inductor/index.html
19. 10.1111/jace.1447210.1111/jace.14472 ↗
20. 10.1111/j.1551-2916.2008.02363.x10.1111/j.1551-2916.2008.02363.x ↗
21. 10.4071/1551-4897-6.1.4910.4071/1551-4897-6.1.49 ↗
22. 10.1111/j.1744-7402.2011.00712.x10.1111/j.1744-7402.2011.00712.x ↗
23. Fraunhofer IKTS.https://www.ikts.fraunhofer.de/content/dam/ikts/downloads/electronics_and_microsystems/hybrid_microsystems/IKTS_326_D_LTCC‐Folien%20nach%20Heraeus‐Rezeptur_final_2016‐04‐16_DEx.pdf
24. 10.1108/MI-11-2019-007210.1108/MI-11-2019-0072 ↗
25. 10.1016/j.jmmm.2004.05.01710.1016/j.jmmm.2004.05.017 ↗
26. 10.1111/j.1151-2916.1996.tb08128.x10.1111/j.1151-2916.1996.tb08128.x ↗
27. 10.1016/0304-8853(96)00217-X10.1016/0304-8853(96)00217-X ↗
28. 10.1109/20.10459210.1109/20.104592 ↗
29. 10.1016/S0304-8853(96)00709-310.1016/S0304-8853(96)00709-3 ↗
30. 10.1007/s10832-016-0043-010.1007/s10832-016-0043-0 ↗
31. 10.1016/j.jeurceramsoc.2016.02.01610.1016/j.jeurceramsoc.2016.02.016 ↗