Effect of gradation on thermal and mechanical properties of reaction‐bonded silicon carbide ceramics

Abstract Particle grading is a reliable method to improve mechanical properties of reaction‐bonded silicon carbide (RBSC) ceramics. This work aims to explore the effects of particle grading on thermal and mechanical characteristics of RBSC ceramics. Results showed that the powder grading enabled to increase sintering density of silicon carbide (SiC) ceramics. The use of large particle SiC powder in grading led to a 28% increase in thermal conductivity but a 22% decrease in bending strength. Meanwhile, the addition of finer SiC powder exerted minimal effect on thermal conductivity but noticeably increased bending strength by 10%. Therefore, properly adjusting particle size in grading allows for the control of residual Si content and microstructure, thereby simultaneously increasing thermal conductivity and bending strength of the material.