journal article·2024-07

Effect of Er 2 O 3 /MgO ratio on mechanical and thermal properties of Si 3 N 4 ceramics

Zhuoqun Han, Jia Liu, Weiwei Wang, Qingxuan Zhou, Zhicheng Zhao, Yongning Han, Yingying Wang, Yang Wang, Futian Liu, Ling Li

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Abstract

Abstract Si 3 N 4 ceramics with high mechanical properties and thermal conductivity, exhibiting fine and bimodal microstructure, were prepared by adjusting the Er 2 O 3 /MgO ratio and hot‐pressing sintering at 1800°C for 4 h. The microstructure, grain distribution, lattice oxygen content, mechanical properties, and crack propagation process of the sintered bulk samples were systematically investigated. It was found that a low Er 2 O 3 /MgO ratio contributed to the densification of Si 3 N 4 ceramics, whereas a high Er 2 O 3 /MgO ratio favored the grain growth of Si 3 N 4 ceramics. In this research, the grain size distribution and average diameters as well as their impact on mechanical properties were examined. When the ratio of Er 2 O 3 /MgO was 3:1, Si 3 N 4 had a larger average diameter and higher thermal conductivity, but the mechanical properties were somewhat reduced. When the ratio of Er 2 O 3 /MgO was 2:2, the sample displayed enhanced mechanical performance, which can be explained by the formation of a bimodal structure. The research indicates that it is feasible to control the microstructure and optimize the mechanical properties of Si 3 N 4 ceramics by tailoring the sintering additives.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Advanced ceramic materials synthesis · MXene and MAX Phase Materials · Advanced materials and composites

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

School of Materials Science and Engineering University of Jinan Jinan China

Shandong Industrial Ceramics Research & Design Institute Co., Ltd Zibo China

Funding

National Key Research and Development Program of China

References (34)

Show source-provided references
1. 10.1016/j.jeurceramsoc.2013.11.04010.1016/j.jeurceramsoc.2013.11.040 ↗
2. 10.1111/j.1551‐2916.2010.04196.x10.1111/j.1551‐2916.2010.04196.x ↗
3. 10.1016/j.msea.2015.07.06210.1016/j.msea.2015.07.062 ↗
4. 10.1111/j.1551‐2916.2010.03839.x10.1111/j.1551‐2916.2010.03839.x ↗
5. 10.1143/JJAP.45.756510.1143/JJAP.45.7565 ↗
6. 10.1007/s40145‐021‐0539‐110.1007/s40145‐021‐0539‐1 ↗
7. 10.1557/mrs2001.11510.1557/mrs2001.115 ↗
8. 10.1007/s40145‐021‐0506‐010.1007/s40145‐021‐0506‐0 ↗
9. 10.1103/PhysRevB.65.13411010.1103/PhysRevB.65.134110 ↗
10. 10.1016/j.jascer.2015.03.00310.1016/j.jascer.2015.03.003 ↗
11. 10.1016/S0955‐2219(02)00374‐610.1016/S0955‐2219(02)00374‐6 ↗
12. 10.1111/j.1151‐2916.2000.tb01182.x10.1111/j.1151‐2916.2000.tb01182.x ↗
13. 10.1016/j.jeurceramsoc.2005.10.01110.1016/j.jeurceramsoc.2005.10.011 ↗
14. 10.1016/j.ceramint.2016.07.02410.1016/j.ceramint.2016.07.024 ↗
15. 10.1016/j.msea.2019.02.02010.1016/j.msea.2019.02.020 ↗
16. 10.1111/j.1151‐2916.2000.tb01501.x10.1111/j.1151‐2916.2000.tb01501.x ↗
17. 10.1111/j.1151‐2916.2001.tb00662.x10.1111/j.1151‐2916.2001.tb00662.x ↗
18. 10.1016/j.ceramint.2019.03.17610.1016/j.ceramint.2019.03.176 ↗
19. 10.1111/j.1551‐2916.2009.03435.x10.1111/j.1551‐2916.2009.03435.x ↗
20. 10.1111/ijac.1409510.1111/ijac.14095 ↗
21. 10.1016/j.jeurceramsoc.2019.10.00310.1016/j.jeurceramsoc.2019.10.003 ↗
22. 10.1111/jace.1727110.1111/jace.17271 ↗
23. 10.1111/ijac.1406710.1111/ijac.14067 ↗
24. 10.1016/j.ceramint.2023.06.18610.1016/j.ceramint.2023.06.186 ↗
25. 10.1016/j.jmrt.2023.10.17110.1016/j.jmrt.2023.10.171 ↗
26. 10.1007/s40145‐021‐0555‐110.1007/s40145‐021‐0555‐1 ↗
27. 10.1016/j.jeurceramsoc.2020.06.00510.1016/j.jeurceramsoc.2020.06.005 ↗
28. 10.1016/j.ceramint.2016.08.05110.1016/j.ceramint.2016.08.051 ↗
29. 10.4028/www.scientific.net/MSF.880.10510.4028/www.scientific.net/MSF.880.105 ↗
30. 10.1111/j.1551‐2916.2006.01195.x10.1111/j.1551‐2916.2006.01195.x ↗
31. 10.1111/jace.1728210.1111/jace.17282 ↗
32. 10.1038/417266a10.1038/417266a ↗
33. 10.1016/j.jallcom.2018.05.00310.1016/j.jallcom.2018.05.003 ↗
34. 10.1016/S0955‐2219(02)00074‐210.1016/S0955‐2219(02)00074‐2 ↗