Preparation and Performance of the Room‐Temperature‐Cured Heat‐Resistant Phosphate Adhesive for C / C Composites Bonding
Source abstract
Abstract
Carbon/carbon( C / C ) composites were bonded with a phosphate adhesive prepared from H 3 PO 4 (orthophosphoric acid) and A l( OH ) 3 as the matrix and S i and C u O as the inorganic fillers. The mechanical properties were tested at room temperature after the bonded specimens were treated from RT to 1500°C. The results showed that the addition of C u O could greatly improve the adhesive's mechanical properties due to the formation of C u n S i (copper silicides). The shear strength of bonded specimens could be up to 8.2 MPa without heat treatment and remain above 2 MPa within the whole heat‐treatment temperature range.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Advanced ceramic materials synthesis · Advanced materials and composites · Silicone and Siloxane Chemistry
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
School of Materials Science and Engineering Key Lab of Advanced Ceramics and Machining Technology of Ministry of Education Tianjin University Tianjin 300072 People's Republic of China
Funding
National Natural Science Foundation of China
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