journal article·2016-09

High‐temperature Bending Strength of Self‐Healing Ni/Al 2 O 3 Nanocomposites

Hai Vu Pham, Makoto Nanko, Wataru Nakao

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Abstract

Bending strength of 5 vol.% Ni/Al 2 O 3 composites as a function of testing temperature is investigated at temperatures ranging from room temperature to 1200°C. Self‐healing performance at high temperatures of the composites is evaluated by conducting high‐temperature bending tests for as‐sintered, as‐cracked, and as‐healed specimens. Bending strength of as‐sintered specimens dramatically decreases from 995 MP a at room temperature to 205 MPa at 1200°C. Additionally, the plastic deformation of the as‐sintered specimens occurs when the testing temperature reaches to 1200°C. The values of high‐temperature bending strength of as‐healed specimens are comparable with those of as‐sintered specimens. Similar to that of as‐sintered specimens, bending strength of as‐healed specimens degrades when the testing temperature increases. Results of the present study indicate that the recovery of bending strength by the self‐healing function is able to achieve at temperatures as high as 1200°C. Unlike the mechanical behaviors at high temperatures of as‐sintered and as‐healed specimens, the bending strength of as‐cracked specimens slightly increases with the increase of testing temperature. This phenomenon is attributed to the effect of the self‐healing mechanism during high‐temperature bending tests.
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Research context

OpenAlex topics: Advanced ceramic materials synthesis · Aluminum Alloys Composites Properties · Advanced materials and composites

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Graduate School of Engineering Nagaoka University of Technology Nagaoka Niigata 940‐2188 Japan

Department of Mechanical Engineering Nagaoka University of Technology Nagaoka Niigata 940‐2188 Japan

Department of Energy & Safety Engineering Yokohama National University Yokohama Kanagawa 240‐8501 Japan

Funding

Japan Science and Technology Agency

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