journal article·2020-09Open access

Microstructure and properties of porous anorthite/mullite whiskers ceramics with high porosity

LingHao Wu, CuiWei Li, Hao Li, ShiBo Li, Chang‐an Wang

Abstract

Abstract Porous anorthite/mullite whiskers ceramics with high porosity (>91%) and high strength (>0.45 MPa) have been successfully prepared by foam gel‐casting method. Effects of extra mullite whiskers on properties including thermal conductivity and compressive strength at different temperatures were investigated and discussed in terms of microstructure observed through SEM and TEM. The results showed that the addition of extra mullite whiskers in certain content could effectively reduce thermal conductivity, improve the compressive strength both at room and high temperature at same time. When the mullite whiskers content was 20 mol%, the porosity was as high as 91.6 ± 0.19%, the thermal conductivity was low to 0.034 ± 0.003 W/(m·K), and the compressive strength at 1000°C was high to 0.64 ± 0.11 MPa three times to the pure one. Small pores, small grains, and more phase interface or grain boundary caused by the addition of extra mullite whiskers were the main factors for low thermal conductivity. Meanwhile, small pores, closely bonded small grains, and the stable three‐dimension network formed by mullite whiskers helped to improve strength.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Advanced ceramic materials synthesis · Recycling and utilization of industrial and municipal waste in materials production · Microwave Dielectric Ceramics Synthesis

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

School of Mechanical Electronic and Control Engineering Beijing Jiaotong University Beijing P. R. China

State Key Laboratory of New Ceramic and Fine Processing School of Materials Science and Engineering Tsinghua University Beijing P. R. China

Funding

National Natural Science Foundation of China · Beijing Key Laboratory of Fine Ceramics, Tsinghua University

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