Fabrication of Precise Fluidic Structures in LTCC
Source abstract
Abstract
A number of emerging applications of low‐temperature co‐fired ceramic (LTCC) require embedded fluidic structure within the co‐fired ceramic and or precise external dimensional tolerances. These structures enable the control of fluids for cooling, sensing, and biomedical applications, and variations in their geometry from the design can have a significant impact on the overall performance of the devices. One example of this type of application is a multilayer cooler developed recently by the authors for cooling laser diode bars. In many laser systems, laser diodes are the primary emitters, or assemblies of these diode bars are used to pump traditional laser crystals such as Nd:YLF. Assemblies of these diodes require large amounts of electrical current for proper operation, and the device operating temperature must be carefully controlled in order to avoid a shift in the output wavelength. These diodes are packaged into water‐cooled assemblies and by their nature dissipate enormous amounts of heat, with waste heat fluxes on the order of 2000 W/cm 2 . The traditional solution to this problem has been the development of copper multilayer coolers. Assemblies of laser diodes are then formed by stacking these diode bars and coolers. Several problems exist with this approach including the erosion of the copper coolers by the coolant, a requirement for the use of deionized water within the system, and a significant CTE mismatch between the diode bar and the metal cooler. Diodes are bonded to these metal structures and liquid coolant is circulated through the metal layers in order to cool the diode bar. In contrast, the coolers developed by the authors utilize fluid channels and jets formed within LTCC as well as embedded cavity structures to control the flow of a high‐velocity liquid and actively cool the laser diode bars mounted on the surface of the LTCC. The dimensional tolerances of these cooler assemblies and complex shapes that are used to control the fluid can have a significant impact on the overall performance of the laser system. This paper describes the fabrication process used to create the precise channel and jet structures used in these LTCC‐based coolers, as well as some of the challenges associated with these processes.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Electrical and Thermal Properties of Materials · Ferroelectric and Piezoelectric Materials · Advanced Sensor Technologies Research
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (11)
Show source-provided references
1. W. A.VitriolandJ. I.Steinberg “Development of a Low Temperature Cofired Multilayer Ceramic Technology ”Proceedings of the ISHM 593–598 1983.
2. S.Nishigaki S.Yano J.Fukuta M.Fukaya andT.Fuwa “A New Multilayered Low‐Temperature‐Fireable Ceramic Substrate ”Proceedings of the ISHM 225–234 1985.
3. S.Nishigaki S.Yano H.Kawabe J.Fukuta T.Nonomura andS.Hebishima “LFC‐III: A new low temperature multilayered ceramic substrate with Au(top)‐Ag(internal)‐Ti/Mo/Cu(bottom) conductor system ”Proceedings of the ISHM 1987 400–407.
4. S.Nishigaki J.Fukuta andS.Yano “A New Low Temperature Fireable Ag Multilayer Ceramic Substrate Having Post Fired Cu Conductor (LFC‐II) ”ISHM Proceedings 429–437 1986.
5. I.Fritsch “Low Temperature Co‐Fired Ceramics in Electrochemical Applications ” Eyitayo Fakunle Prabhu Arumugam Padhmodhbhava Yoga Narasimhan Melissa Weston Emily Ander‐son Gangqiang Wang Fred Barlow 209th ECS Meeting Denver CO May 7–12 2006.
6. LTCC Enzymatic Microreactor10.4071/1551-4897-4.2.51 ↗
7. Development of LTCC Smart Channels for Integrated Chemical, Temperature, and Flow Sensing10.4071/1551-4897-3.3.136 ↗
8. Low Temperature Cofired Ceramic Microfluidic Microsystems for High Temperature and High Pressure Applications10.4071/1551-4897-3.3.152 ↗
9. Miniature Multi‐Electrode Electrochemical Cell in LTCC10.4071/1551-4897-4.1.31 ↗
10. K.Saxena G.Wang F.Barlow S.Ang andA.Elshabini “A Microjet Array Air Impingement Cooling Package Fabricated using Low Temperature Cofired Ceramic ”IMAPS Ceramics Conference Denver CO April 26–28 2004.
11. E. F.Stephens R.Feeler G.Kemner F.Barlow J.Wood andA.Elshabini “Micro‐fluidic Optoelectronic Packages based on LTCC ”Proceedings of the 2007 International Microelectronics and Packaging Conference San Jose CA November2007429–436.