Control of the bonding process in a medium technology industry
Bibliographic record
Abstract
No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.
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Research context
OpenAlex topics: Mechanical Behavior of Composites · Electronic Packaging and Soldering Technologies · Epoxy Resin Curing Processes
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (6)
Show source-provided references
1. Pettit · Plastics and Rubber International · 1981 · 6 · 205
2. Pettit · J Adhesion · 1973 · 5 · 33310.1080/00218467308072234 ↗
3. Dermitron D-8 (UPA Technology Inc, New York 11791, USA)
4. SATRA Method AM 1 British Standard BS 5131: Subsection 1.1.2
5. SATRA Method AM 4 British Standard BS 5131: Section 5.1
6. SATRA Method AM 11 British Standard BS 5131: Section 5.4