The use of thermal analysis to investigate the cure of reactive adhesives
Bibliographic record
Abstract
No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.
Source: Not provided · Quality: missing
Research context
OpenAlex topics: Epoxy Resin Curing Processes · Mechanical Behavior of Composites · Fiber-reinforced polymer composites
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References (5)
Show source-provided references
1. Borchardt and Daniels ‘DSC Kinetics Data Analysis’ (Du Pont Publ. E50 184)
2. Provder · J Coatings Technol · 1989 · 61 · 33
3. Prime · 1981
4. Mita · 1987 · C27 · 91
5. Tanaka · 1988