journal article·2003-01

Physico-chemical analysis on chemical bonding at adhesion interface between rubber and Pd alloy

Yoshiyuki Ikeda, Hidemi Nawafune, Shozo Mizumoto, Muneo Sasaki, Asahiro Nagatani, Akihito Nishimori, Koichi Yamaguchi, Ei Uchida, Takashi Okada

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Abstract

Abstract Some spectroscopic analyses were carried out on the adhesive interface layers formed by cure-adhesion of natural rubber to electroless Pd and/or Pd–P alloys. The transmission electron microscopy revealed some clear images of the adhesion layer just at the interface between rubber and electroless-plating films of Pd and/or Pd–P alloys. The content ratio of Pd/S analyzed by energy dispersive X-ray spectroscopy changed gradually along the depth at the rubber–metal interface layer for Pd alloy, but was kept almost constant irrespective of depth for Pd–P alloy.
Source: openaire · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Electrodeposition and Electroless Coatings · Corrosion Behavior and Inhibition · Electronic Packaging and Soldering Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (9)

Show source-provided references
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