Physico-chemical analysis on chemical bonding at adhesion interface between rubber and Pd alloy
Source abstract
Abstract
Abstract Some spectroscopic analyses were carried out on the adhesive interface layers formed by cure-adhesion of natural rubber to electroless Pd and/or Pd–P alloys. The transmission electron microscopy revealed some clear images of the adhesion layer just at the interface between rubber and electroless-plating films of Pd and/or Pd–P alloys. The content ratio of Pd/S analyzed by energy dispersive X-ray spectroscopy changed gradually along the depth at the rubber–metal interface layer for Pd alloy, but was kept almost constant irrespective of depth for Pd–P alloy.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electrodeposition and Electroless Coatings · Corrosion Behavior and Inhibition · Electronic Packaging and Soldering Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (9)
Show source-provided references
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