journal article·1995-04

Quality assurance in adhesive technology

A.W. Espie, J.H. Rogerson, K. Ebtehaj

Publisher page

Abstract

No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.

Source: Not provided · Quality: missing

Research context

OpenAlex topics: Manufacturing Process and Optimization · Electronic Packaging and Soldering Technologies · Flexible and Reconfigurable Manufacturing Systems

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (2)

Show source-provided references
1. Espie · 1993 · 237
2. Jones · 1990 · 44