journal article·1993-07

A study of the cure of adhesives using dynamic mechanical analysis

R.W. Cook, D.A. Tod

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Abstract

No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.

Source: Not provided · Quality: missing

Research context

OpenAlex topics: Epoxy Resin Curing Processes · Injection Molding Process and Properties · Mechanical Behavior of Composites

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (7)

Show source-provided references
1. Murayama · 1978
2. Shaw · J Adhesion · 1989 · 28 · 23110.1080/00218468908030172 ↗
3. Shaw · 1988
4. Wolfe · J Macromol Sci Chem · 1989 · A26 · 24910.1080/00222338908053851 ↗
5. Shaw · 1987
6. Kinloch · 1984 · 208
7. Tod · 1987