On the failure mechanism of anisotropically conductive adhesive joints on copper metallisation
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Abstract
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Research context
OpenAlex topics: Mechanical Behavior of Composites · Material Properties and Applications · Electronic Packaging and Soldering Technologies
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References (7)
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1. Liu · 1994
2. Hutton · 1994
3. Rörgren · IEEE Trans. Components, Packaging and Manufacturing Technology—Part B · 1995 · 18 · 30510.1109/96.386266 ↗
4. Klosterman, D., Rak, S., Wille, S., Dubinski, D., Desai P. Proc. 1st Int. Conf. on Adhesive Joining Technology in Electronics Manufacturing, Berlin, Germany, VDE/VDI-Verlag gmbh, 2–4 November
5. Liu · IEEE transactions of Components, Packaging and Manufacturing Technology—Part B · 1995 · 18 · 31310.1109/96.386267 ↗
6. Li · 1995 · 114
7. Carmichael · 1994 · Vol. I