An experimental investigation of shear strength and adhesion on the chip-substrate joint in LED packaging
Source abstract
Abstract
For the robust design of LED packaging, it is necessary to develop information on the shear strength requirement for a chip-substrate joint. This experimental work investigated the suitable shear strength and examined the surface condition after shear failure. Four different applicators were used to apply the non-conductive adhesive (NCA) to evaluate the shear strength of the various samples. The result indicated that the suitable shear strength 37.42 N/mm 2 obtains at 24 μm thickness of the adhesive layer. The shear stress has no remarkable effect on the amount of adhesion area compared to the chip surface area. The NCA lost weight at a significant rate after curing. The results revealed that the gold (Au) plated chip surface has more adhesion than the Silver (Ag) based substrate surface. The current findings provide insight into the adhesion of chip-substrate joints for the engineer and researcher in the LED packaging process.
Source: expertdata · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Nanofabrication and Lithography Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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