Critical analysis of the substrate deformation correction in the thick-adherend tensile-shear test
Source abstract
Abstract
The substrate deformation correction in the tensile-shear test of adhesive technology has been investigated. A technique based on the finite element method simulating the deformation behaviour of a reference specimen is compared with the simple procedure resting on Hooke's law according to ISO 11003-2. The simulations reveal that the numerical correction technique based on the finite element deformation modelling of the reference specimen leads to more realistic results. Explanations of the deviation from the correction founded on Hooke's law are given.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Advanced Surface Polishing Techniques · Metal Forming Simulation Techniques
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References (6)
Show source-provided references
1. ISO 11003-2. Adhesives—determination of shear behaviour of structural bonds—part 2: thick-adherend tensile-test method. 1993.
2. ISO 11003-2. Adhesives—determination of shear behaviour of structural adhesives—part 2: tensile method using thick adherends. 2001.
3. Flügge · 1962
4. Application of the finite element method in the tensile-shear test of adhesive technology10.1016/S0143-7496(01)00012-4 ↗
5. Reiner · 1960
6. Verbesserte methode der kennwertbestimmung