Investigating the change in surface acoustic wave velocity due to the change in adhesion of a SU-8 thin film using a SU-8/AlN/Si SAW sensor
Source abstract
Abstract
Abstract This study investigates the change in surface acoustic wave (SAW) phase velocity due to the change in adhesion of a SU-8 thin film using an Aluminum Nitride (AlN)/Silicon (Si) SAW sensor. The variation in the stress field at the SU-8/AlN interface at different levels of SU-8 adhesion is also investigated and correlated to the change in SAW phase velocity. A theoretical model is developed to determine the change in wave dispersion profile due to the change in adhesion of the SU-8 film on the surface of the AlN/Si sensor. The interface of the SU-8/AlN layers is represented by a layer of massless springs with interface stiffness K (N/m 3 ). The results illustrate that as the adhesion of the SU-8 film weakens on the surface of the AlN/Si SAW sensor the velocity dispersion profiles fluctuate. The calculated stress field at the SU-8/AlN interface also fluctuates because the weakened interface cannot sustain the increased stress due to the confinement of the wave near the interface. Therefore, the mode of wave propagation varies between the perfect bond case where the SU-8 layer is perfectly bonded to the AlN/Si surface and when the SU-8 is completely de-bonded. Four SAW sensor designs operating in the frequency range of 84–208 MHz are developed to measure the shift in the center frequency values and the corresponding change in SAW phase velocities due to the change in adhesion of the SU-8 layer. The adhesion of the SU-8 film on the surface of the AlN/Si SAW sensor is changed by using different adhesion layers. The adhesion layers used are a gold film and an omnicoat coated gold film. Omnicoat is an adhesion promoter used to improve the adhesion of SU-8. The results illustrate that as the adhesion of the SU-8 film improves for the sensors with omnicoat the wave velocity shifts to a lower value. The wave velocity values are fitted with the wave dispersion profiles for different values of the interface spring stiffness K . The interface spring stiffness values for the SAW sensors with omnicoat coated gold and gold films are 8.1×10 9 N/m 3 and 7.95×10 9 N/m 3 , respectively. The use of omnicoat improves the adhesion of the SU-8 film and corresponds to a higher interface spring stiffness value. The stress and displacement fields generated in the SU-8 layer for different values of the interface spring stiffness K are plotted. The results illustrate that as the adhesion of the SU-8 layer improves the stress transmitted to the SU-8 layer increases and the wave is more confined in the SU-8 layer, which justifies the drop in wave velocity since the Rayleigh wave velocity in SU-8 is much lower in comparison to AlN and Silicon; 1166, 5600, 5000 m/s, respectively.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Acoustic Wave Resonator Technologies · Ultrasonics and Acoustic Wave Propagation · Adhesion, Friction, and Surface Interactions
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (39)
Show source-provided references
1. Characterization of high performance composite coating for the northern pipeline application10.1016/j.porgcoat.2007.07.013 ↗
2. Review and comparison of shearography and pulsed thermography for adhesive bond evaluation10.1117/1.2741277 ↗
3. Ultrasonic guided wave inspection of a titanium repair patch bonded to an aluminum aircraft skin10.1016/j.ijadhadh.2010.05.008 ↗
4. Balancing osteoblast functions and bacterial adhesion on functionalized titanium surfaces10.1016/j.biomaterials.2012.01.018 ↗
5. Enhanced cellular adhesion on titanium by silk functionalized with titanium binding and RGD peptides10.1016/j.actbio.2012.09.003 ↗
6. Strength estimation of adhesively bonded tongue and groove joint of thick composite sandwich structures using genetic algorithm approach10.1016/j.ijadhadh.2009.09.005 ↗
7. Debonding of command adhesive joints for the automotive industry10.1016/j.ijadhadh.2015.01.014 ↗
8. Pulsed eddy current imaging and frequency spectrum analysis for hidden defect nondestructive testing and evaluation10.1016/j.ndteint.2011.01.009 ↗
9. Validation of size estimation of debonds in external wall’s composite finishes via passive infrared thermography and a gradient algorithm10.1016/j.conbuildmat.2015.03.032 ↗
10. Comparison of normal and oblique incidence ultrasonic measurements for the detection of environmental degradation of adhesive joints10.1016/S0963-8695(01)00057-3 ↗
11. Quantitative ultrasonic characterization of environmental degradation of adhesive bonds10.1163/156856104773635463 ↗
12. Pulse-echo NDT of adhesively bonded joints in automotive assemblies10.1016/j.ultras.2008.07.001 ↗
13. Ultrasonic guided wave inspection of adhesive bonds between composite laminates10.1016/j.ijadhadh.2013.04.001 ↗
14. A dispersion compensation procedure to extend pulse-echo defects location to irregular waveguides10.1016/j.ndteint.2012.12.009 ↗
15. Intrinsic stress in sputter deposited thin films10.1080/10408439208244586 ↗
16. Miyazaki · 2009
17. The origin of stresses in magnetron sputtered thin films with zone T structures10.1016/j.actamat.2009.12.048 ↗
18. Residual stresses in thin film systems: effects of lattice mismatch, thermal mismatch and interface dislocations10.1016/j.ijsolstr.2013.06.022 ↗
19. Dupont SR, Voroshazi E, Heremans P, Dauskardt RH. The effect of anneal, solar irradiation and humidity on the adhesion/cohesion properties of P3HT:PCBM based inverted polymer solar cells. In Proceedings of the 38th IEEE photovoltaic specialists conference. Austin, TX, USA; 2012.10.1109/PVSC.2012.6318272 ↗
20. Adhesion and degradation of hard coatings on poly (methyl methacrylate) substrates10.1016/j.tsf.2010.08.116 ↗
21. Evaluation of thin film adhesion to substrates by means of surface acoustic wave dispersion10.1016/j.tsf.2010.05.086 ↗
22. Richard P, Gremaud G, Kulik A. Thin film adhesion investigations with the acoustic microscope. In Proceedings of the IEEE ultrasonics symposium, part (1 of 3). Cannes, France; 1994.10.1109/ULTSYM.1994.401859 ↗
23. Characterization of film interface integrity through scanning acoustic microscopy10.1016/S0257-8972(98)00484-8 ↗
24. Polymeric microfabricated electrochemical nanoprobe with adressable electrodes10.1016/j.snb.2011.04.052 ↗
25. Investigation of the bond strength between the photo-sensitive polymer SU-8 and gold10.1016/j.mee.2004.12.021 ↗
26. Farnell · 1972 · 9
27. The testing of adhesive-bonded joints by a very high-resolution ultrasonic probe10.1088/0022-3727/12/5/023 ↗
28. Scaled behaviour of interface waves at an imperfect solid-solid interface10.1063/1.4733949 ↗
29. Huo · 2008
30. Green׳s-function method for modeling surface acoustic wave dispersion in anisotropic material systems and the determination of material properties10.1016/j.wavemoti.2004.02.007 ↗
31. Investigation of solid/solid interface waves with laser ultrasonics10.1016/j.ultras.2006.07.010 ↗
32. The determination for the adhesion of film and substrate by surface acoustic waves10.1016/j.surfcoat.2007.04.040 ↗
33. A quantitative study on the adhesion property of cured SU-8 on various metallic surfaces10.1007/s00542-005-0587-4 ↗
34. Effects of surface treatments on the adhesion of Cu and Cu/Cr metallizations to a multifuctional photoresist10.1063/1.1495528 ↗
35. Fabrication and characterization of an SU-8 gripper actuated by a shape memory alloy thin film10.1088/0960-1317/13/2/323 ↗
36. Zero temperature coefficient saw devices on aln epitaxial films10.1109/T-SU.1985.31647 ↗
37. Madou · 1997
38. Evaluating the adhesion of SU-8 thin films using an AlN/Si surface acoustic wave sensor
39. Datta · 1986