Behavior and failure of adhesive bonds in pin fin heat sinks using cohesive zone model
Source abstract
Abstract
Abstract Adhesive bonding is a versatile material joining method that tends to distribute the load over the bonded area and provide more flexibility in selecting the base material without worrying about the joining process and its effects. To improve the performance of heat sinks, polymer composite pin fin are used to improve the thermal conductivity. Adhesives are usually used in bonding composite fins to their metal base plate. In this work we provide a methodology for estimating the fatigue life of the adhesive joint. A thermo-mechanical cohesive zone model (CZM) is used at the interfaces to measure the softening of the bond under thermal cyclic loading which in turn decreases the critical stress for failure. A summary of the fatigue crack initiation (FCI) life prediction model is presented before a qualitative study is performed to estimate the effect of convection environment on the life and behavior of the adhesive bond.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Mechanical Behavior of Composites · Electronic Packaging and Soldering Technologies · Fatigue and fracture mechanics
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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