Analytical model of thermal stress distribution of bonded structure under temperature field
Source abstract
Abstract
Abstract Thermal stress analytical model of three-layer bonded structure under temperature field based on physical mechanical law was established in this paper. Thermal stress distribution of bonded structure composed of silicone chip, polyimide film and composite under temperature gradient from −120 °C to 100 °C was also investigated. It is concluded that thermal stress at −120 °C is larger than that at 100 °C. The maximal and minimal normal stresses of bonded structure are in the polyimide film and silicone chip, respectively. Maximal shear stress is in adhesive layer between the polyimide film and the composite.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Synthesis and properties of polymers · Mechanical Behavior of Composites · Epoxy Resin Curing Processes
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (8)
Show source-provided references
1. Tiger—program for thermospheric-ionospheric geospheric research10.1016/S0273-1177(02)00210-7 ↗
2. Investigation and development of joints of Truss-structure satellite
3. Adhesive bonding of aircraft structures10.1016/S0143-7496(00)00006-3 ↗
4. Cogs well FN. Thermoplastics for space
5. Manufacture of adhesive joints and bulk specimens with high-temperature adhesives10.1016/S0143-7496(03)00101-5 ↗
6. Steady-state thermal geometrical non-liner stress analysis of an adhesively bonded t1111111ee joint with double support
7. Consider breadth when calculate strain-stress state of multilayer adhesive joint
8. Karpov JC, Krivenda CP, Rjabkov VI. Design and structure of bonded part making from composites materials, Kharkov: Kharkov aerial College; 1997, in Russian.