journal article·2001-01

Application of the finite element method in the tensile-shear test of adhesive technology

A. Öchsner, J. Gegner

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Abstract

Abstract According to ISO 11003-2, the tensile-shear test was used in an in situ investigation of the mechanical behaviour of a bonded metal joint. The adherend deformation correction resulted simulation-aided from a finite element calculation. An anaerobic adhesive was tested using steel substrates with a 30 μm bond gap. Shear stress-strain diagrams were determined for different testing temperatures. From these diagrams, the shear modulus could be derived from the linear segment of the curve. The shear modulus showed a typical temperature dependence for thermoplastics in the glass transition area. For extension of the computer aided test evaluation, a finite element technique for an iterative determination of the Young's modulus was developed.
Source: openaire · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Electronic Packaging and Soldering Technologies · Mechanical Behavior of Composites · 3D IC and TSV technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (12)

Show source-provided references
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