journal article·1985-07

Toughened bismaleimide adhesives

S.J. Shaw, A.J. Kinloch

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Abstract

No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.

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Research context

OpenAlex topics: Epoxy Resin Curing Processes · Synthesis and properties of polymers · Mechanical Behavior of Composites

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (13)

Show source-provided references
1. A review of high temperature adhesives
2. Pike · 1975 · 1
3. St Clair · Polym Engng Sci · 1982 · 22 · 910.1002/pen.760220103 ↗
4. Stenzenberger · Brit Polym J · 1983 · 15 · 210.1002/pi.4980150103 ↗
5. Kinloch · Polymer · 1983 · 24 · 134110.1016/0032-3861(83)90070-8 ↗
6. Kinloch · Polymer · 1983 · 24 · 135510.1016/0032-3861(83)90071-X ↗
7. Drake · SAMPE Quarterly · 1975 · 6 · 11
8. Kinloch · UK Patent Application 8 236 849 · 1982
9. Kinloch · UK Patent Application 8 416 024 · 1984
10. Kinloch · 1984 · 101
11. Knight · 1979 · 145
12. Kinloch · 1983
13. ASTM Standard D790-71 (American Society for Testing and Materials)