journal article·2016-03

Design analysis of sandwiched structures experiencing differential thermal expansion and differential free-edge stretching

E.H. Wong

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Abstract

Abstract Compared to the theory of elasticity solutions the strength of material solutions offer closed form solutions that is favoured by practising engineers for performing design analysis. However, the existing strength of material solutions for a sandwich structure experiencing differential thermal strains have principally ignored the free edge conditions; and for the very limited publications that have enforced the free edge conditions, the solutions have been inaccurate. Understandably, design analysis using such solutions is unreliable. This manuscript describe a solution technique that enforces the nil shear stress condition at the free edge using a high power exponential function resulting in a simple yet accurate closed form solutions for the interfacial shear stress. The interfacial peeling stress is made up of two components: the mean and the amplitude of variations of the transverse normal stress in the bonding layer; the latter is the dominant component whose magnitude is linearly proportional to the gradient of the interfacial shear stress. Following validation by finite element analysis, design analysis for debonding, fracturing, and out-of-plane deformation are performed using the concise closed form solutions.
Source: openaire · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Mechanical Behavior of Composites · Composite Structure Analysis and Optimization · Cellular and Composite Structures

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (40)

Show source-provided references
1. The tension of metallic films deposited by electrolysis10.1098/rspa.1909.0021 ↗
2. Analysis of bi-metal thermostats10.1364/JOSA.11.000233 ↗
3. Thermal stresses in a rectangular plate clamped along an edge10.1115/1.4009924 ↗
4. Edge-bonded dissimilar orthogonal elastic wedges under normal and shear loading10.1115/1.3601236 ↗
5. Discussion on Bogy (1968)10.1115/1.3564739 ↗
6. Stress singularities in a two-material wedge10.1007/BF00184307 ↗
7. Thermal stresses in a long rectangular plate constrained at one of the shorter edges10.1016/S0020-7403(62)80010-1 ↗
8. The elastic strip under mixed boundary conditions10.1115/1.3629742 ↗
9. Thermal stresses in composite beams10.1016/0020-7683(69)90009-2 ↗
10. The end problem for a laminated elastic strip II-differential expansion stresses10.1177/002199836900300206 ↗
11. Stresses and strains in a plate bonded to a substrate: semiconductor devices10.1016/0038-1101(71)90172-9 ↗
12. Stress fields in composite laminates10.1016/0020-7683(78)90020-3 ↗
13. Thermal stresses in laminated beams10.1115/1.2792218 ↗
14. Asymptotic analysis of the thermal stresses in a lwo-layer composite with an adhesive layer10.1080/01495738508942229 ↗
15. Thermal stress at the edge of a bi-metallic thermostat10.1115/1.3176131 ↗
16. Asymptotic expansions for the thermal stresses in bonded semi-infinite biomaterial strips10.1115/1.2905383 ↗
17. Thermal stresses and free-edge effects in laminated beam-a variational approach using stress function10.1115/1.2905369 ↗
18. The effects of inclined free edges on the thermal stresses in a layered beam10.1115/1.2909319 ↗
19. Free-edge effects in laminate under extension, bending and twisting: Part I: a stress function approach10.1115/1.2901459 ↗
20. A method for the stress analysis of lap joint10.1080/00218469208030455 ↗
21. Analysis of interfacial thermal stresses of chip-substrate structure10.1016/S0020-7683(00)00099-8 ↗
22. Thermal stress and fracture in shear-constrained semiconductor device structures10.1109/T-ED.1962.14987 ↗
23. Analytical study of interlaminar shear stresses in a laminated composite plate
24. Interlaminar thermoelastic stresses in layered beams10.1080/01495737808926932 ↗
25. Thermal stresses in bonded joints10.1147/rd.232.0179 ↗
26. Stresses in bi-metal thermostats10.1115/1.3171827 ↗
27. Stresses in adhesively bonded bi-material assemblies used in electronic packaging
28. Interfacial stresses in bimetal thermostats10.1115/1.3176133 ↗
29. Approximate evaluation of the elastic interfacial stresses in the thin films with application to high-Tc superconducting ceramics10.1016/0020-7683(91)90098-Z ↗
30. Adhesively bonded assemblies with identical nondeformable adherends: predicted thermal stresses in the adhesive layer
31. Predictive analytical thermal stress modeling in electronics and photonics10.1115/1.3077136 ↗
32. Realistic modeling of edge effect stresses in bimetallic elements10.1115/1.2904333 ↗
33. Interfacial shear and peel stresses in multi-layered thin stacks subjected to uniform thermal loading10.1115/1.2905382 ↗
34. Simplified engineering approach for the evaluation of thermally induced stresses in bi-material microelectronic structures
35. Thermal stresses in layered electronic assemblies10.1115/1.2792218 ↗
36. Interfacial thermal stress in bimaterial elastic beams: modified beam model revisit10.1115/1.1481037 ↗
37. An analytical model for thermal stress analysis of multi-layered microelectronic packaging10.1016/S0167-6636(03)00076-0 ↗
38. A note on Suhir’s solutions of thermal stresses for a die-substrate assembly10.1115/1.1648056 ↗
39. Analytical solutions for PCB assembly subjected to mismatched thermal expansion10.1109/TADVP.2009.2025222 ↗
40. Thermal stresses in the discrete joints of sandwiched structures10.1016/j.compstruct.2015.01.027 ↗