Fatigue life prediction of adhesive joint in heat sink using Monte Carlo method
Source abstract
Abstract
Abstract A finite element model of the heat sink along with a fatigue life prediction model can be used to investigate the thermal stress cyclic effect on thermo-mechanical reliability performance. However, the variability of the governing parameters makes the life prediction probabilistic. The Monte Carlo simulation is used to study the effect of random variation associated with the governing parameters on the predicted fatigue life of the heat sink. It has been found that the variability affects the predicted life significantly as almost half of the considered sample points have predicted life that differs from deterministic predicted values by some order of magnitudes.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Thermography and Photoacoustic Techniques · Fire effects on concrete materials · Thermal properties of materials
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (21)
Show source-provided references
1. Orthotropic thermal conductivity effect on cylindrical pin fin heat transfer10.1016/j.ijheatmasstransfer.2006.04.025 ↗
2. Study of orthotropic pin fin performance through axisymmetric thermal non-dimensional finite element10.1016/j.applthermaleng.2010.09.028 ↗
3. Aluminum filled heat sink bonding resin (CC3-450), 〈http:/www.cast-coat.com/cc3-450.html〉 (accessed on 05-03-2013).
4. Parametric dependence of fatigue of electronic adhesives10.1109/6144.774732 ↗
5. Fatigue life prediction of adhesively bonded single lap joints10.1016/j.ijadhadh.2010.10.002 ↗
6. Budynas · 2011
7. Fatigue of joints in composite structures
8. Tian X, Prince JL. Electronic packaging adhesive fatigue life prediction using thermal cycling step-stress testing. In: Reliability and maintainability symposium; 2002, 628–635.
9. Bjorneklett A, Tuhus T, Halbo L, Kristiansen H. Thermal resistance, thermomechanical stress and thermal cycling endurance of silicon chips bonded with adhesives. In: Semiconductor thermal measurement and management symposium; 1993, 136–143.10.1109/STHERM.1993.225321 ↗
10. Effects of temperature cycling and elevated temperature/humidity on the thermal performance of thermal interface materials10.1109/TDMR.2009.2025367 ↗
11. Manson · 2006
12. On some basic problems of research in engineering10.1016/S0142-1123(01)00040-8 ↗
13. Pashah S, Arif Abul Fazal M. Thermo-mechanical fatigue life prediction of orthotropic composite pin fin heat sinks for electronic packaging. In: ASME conference proceedings; 2011, Paper no. IPACK2011-52181. 271-279.10.1115/IPACK2011-52181 ↗
14. JEDEC Standard JESD22-A104D, temperature cycling, JEDEC Solid State Technology Association; 2009.
15. JEDEC Standard JESD22-A122, power cycling, JEDEC Solid State Technology Association; 2007.
16. JEDEC Standard JESD22-A105C, power and temperature cycling, JEDEC Solid State Technology Association; 2004.
17. Mital SK, Murthy PLN. Quantifying uncertainties in the thermo-mechanical properties of particulate reinforced composites, NASA Technical Memorandum, NASA/TM-1999-209174; 1999.
18. Failure property distributions for conventional and highly crosslinked ultrahigh molecular weight polyethylenes10.1002/jbm.b.30163 ↗
19. Sobol · 1994
20. ANSYS advanced analysis techniques guide, ANSYS Inc., USA.
21. Temperature dependent elastic & thermal properties database (MPDB software), 〈http:/www.jahm.com/〉 (accessed on 05-03-2013).